机构

• 力学研究所 [1]
• 长春光学精密机械与物... [1]
• 国家天文台 [1]
• 上海应用物理研究所 [1]

采集方式

• OAI收割 [4]

内容类型

• 期刊论文 [3]
• 会议论文 [1]

发表日期

• 2017 [1]
• 2014 [1]
• 2013 [1]
• 2004 [1]

学科主题

• 交叉与边缘领域的力学... [1]

筛选

浏览/检索结果: 共4条，第1-4条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 An Analysis of Outlier Spectrum: LAMOST J140242. 45+092049. 8 期刊论文  OAI收割 SPECTROSCOPY AND SPECTRAL ANALYSIS, 2017, 卷号: 37, 期号: 4, 页码: 1269-1273 作者:  Yang Hai-feng;  Cai Jiang-hui;  Zhang Ji-fu;  Luo A -li;  Zhao Xu-jun 收藏  |  浏览/下载：31/0  |  提交时间：2017/09/01 Dual-redshift systems  Lens  Galaxy pairs  Outlier mining   Design of an efficient monochromatic electron source for inverse photoemission spectroscopy 期刊论文  OAI收割 CHINESE PHYSICS C, 2014, 卷号: 38, 期号: 11 Geng, DP; Yang, YG; Liu, SH; Hong, CH; Gao, XY 收藏  |  浏览/下载：56/0  |  提交时间：2015/03/13 ENERGY ANALYZERS  PHOTON DETECTOR  LENS SYSTEMS  LOW-VOLTAGE  RESOLUTION  GUN   Fundamentals and applications of electrowetting: A critical review 期刊论文  OAI收割 REVIEWS OF ADHESION AND ADHESIVES, 2013, 卷号: 1, 期号: 1, 页码: 114-174 作者:  Zhao YP(赵亚溥);  Wang Y(王樱) 收藏  |  浏览/下载：55/0  |  提交时间：2014/02/13 Electrowetting (EW)  electrowetting-on-dielectric (EWOD)  Lippmann-Young (L-Y) equation  curvature effect  elasto-electro-capillarity (EEC)  Lattice Boltzmann method (LBM)  phase-field model  molecular dynamics (MD) simulations  coffee stain ring  electronic display  liquid lens  Micro Total Analysis Systems (μ-TAS)  cell-based digital microfluidics   Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文  OAI收割 MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China 作者:  Wang W.;  Wang L.;  Wang L.;  Wang L.;  Chen W. 收藏  |  浏览/下载：33/0  |  提交时间：2013/03/25 We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.