机构

• 长春光学精密机械与物... [1]
• 新疆理化技术研究所 [1]
• 自动化研究所 [1]
• 沈阳自动化研究所 [1]

采集方式

• OAI收割 [4]

内容类型

• 会议论文 [2]
• 期刊论文 [2]

发表日期

• 2021 [1]
• 2014 [1]
• 2012 [1]
• 2004 [1]

学科主题

筛选

浏览/检索结果: 共4条，第1-4条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Structure bionic design method oriented to integration of biological advantages 期刊论文  OAI收割 STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION, 2021, 页码: 23 作者:  Yang, Yong;  Zhu, Qi-Xin;  Wang, Wei;  Peng, Xuan   |  收藏  |  浏览/下载：26/0  |  提交时间：2021/06/15 Structure bionic design  High-specific-stiffness mechanical structure  Integration of biological advantages  Matter-element   The wireless network routing protocols and data communication methods for multiple sensor information used in mining mechanical 期刊论文  OAI收割 Key Engineering Materials, 2014, 卷号: 621, 期号: 8, 页码: 288-293 作者:  Wang, Meng1,2;  Tang, Xinyu1,2;  Zeng, Wenxiao1;  Zhou, Junlin1;  Zhang, Ronghui1   |  收藏  |  浏览/下载：13/0  |  提交时间：2021/03/24 Wireless sensor network  Routing protocols  Computer integrated simulation  Mechanical and electrical integration  Mining Mechanical   The Optimization of Mechanical and Electrical Integration Linear Output Transmission System with Sensor Function 会议论文  OAI收割 Guangzhou, China, November 16-18, 2012 作者:  Liu YW(刘玉旺);  Leng YQ(冷雨泉);  Luo HT(骆海涛)   |  收藏  |  浏览/下载：18/0  |  提交时间：2012/12/28 Electrical Integration  Linear Output  Mechanical Integration  Optimization  Parameter   Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文  OAI收割 MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China 作者:  Wang W.;  Wang L.;  Wang L.;  Wang L.;  Chen W. 收藏  |  浏览/下载：30/0  |  提交时间：2013/03/25 We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.