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CAS IR Grid
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金属研究所 [9]
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Varying tensile fracture mechanisms of Cu and Cu-Zn alloys with reduced grain size: From necking to shearing instability
期刊论文
OAI收割
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2014, 卷号: 594, 页码: 309-320
P. Zhang
;
S. Qu
;
M. X. Yang
;
G. Yang
;
S. D. Wu
;
S. X. Li
;
Z. F. Zhang
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Enhanced cyclic deformation responses of ultrafine-grained Cu and nanocrystalline Cu-Al alloys
期刊论文
OAI收割
Acta Materialia, 2014, 卷号: 74, 页码: 200-214
X. H. An
;
S. D. Wu
;
Z. G. Wang
;
Z. F. Zhang
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Local decomposition induced by dislocation motions inside tetragonal Al2Cu compound: slip system-dependent dynamics
期刊论文
OAI收割
Scientific Reports, 2013, 卷号: 3
D. Chen
;
X. L. Ma
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Mechanically driven annealing twinning induced by cyclic deformation in nanocrystalline Cu
期刊论文
OAI收割
Scripta Materialia, 2013, 卷号: 68, 期号: 12, 页码: 988-991
X. H. An
;
Q. Y. Lin
;
S. D. Wu
;
Z. F. Zhang
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Formation of fivefold deformation twins in an ultrafine-grained copper alloy processed by high-pressure torsion
期刊论文
OAI收割
Scripta Materialia, 2011, 卷号: 64, 期号: 3, 页码: 249-252
X. H. An
;
Q. Y. Lin
;
S. D. Wu
;
Z. F. Zhang
;
R. B. Figueiredo
;
N. Gao
;
T. G. Langdon
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Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nano structured Cu-Al alloys subjected to plastic deformation
期刊论文
OAI收割
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6048-6058
Y. Zhang
;
N. R. Tao
;
K. Lu
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Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
期刊论文
OAI收割
Science, 2009, 卷号: 324, 期号: 5925, 页码: 349-352
K. Lu
;
L. Lu
;
S. Suresh
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Combined effects of crystallographic orientation, stacking fault energy and grain size on deformation twinning in fcc crystals
期刊论文
OAI收割
Philosophical Magazine, 2008, 卷号: 88, 期号: 24, 页码: 3011-3029
W. Z. Han
;
Z. F. Zhang
;
S. D. Wu
;
S. X. Li
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Effect of Precipitations on Microstructures and Mechanical Properties of Nanostructured Al-Zn-Mg-Cu Alloy
期刊论文
OAI收割
Materials Transactions, 2008, 卷号: 49, 期号: 12, 页码: 2912-2915
H. B. Chen
;
B. Yang
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