中国科学院机构知识库网格系统: 检索

浏览/检索结果: 共4条，第1-4条

帮助

条数/页：排序方式：
	Strain-softening analysis of a spherical cavity 期刊论文 OAI收割 INTERNATIONAL JOURNAL FOR NUMERICAL AND ANALYTICAL METHODS IN GEOMECHANICS, 2012, 卷号: 36, 期号: 2, 页码: 182-202 作者: Wu, Zhenjun; Yin, Shunde; Wang, Shuilin \| 收藏 \| 浏览/下载：16/0 \| 提交时间：2018/06/05 spherical cavity strain-softening Mohr-Coulomb criterion Hoek-Brown criterion complete stress-strain curve
	A closed-form solution for a spherical cavity in the elastic-brittle-plastic medium 期刊论文 OAI收割 TUNNELLING AND UNDERGROUND SPACE TECHNOLOGY, 2011, 卷号: 26, 期号: 1, 页码: 236-241 作者: Yin, Shunde; Wang, Shuilin \| 收藏 \| 浏览/下载：24/0 \| 提交时间：2018/06/05 Spherical cavity Brittle-plastic medium Mohr-Coulomb criterion Hoek-Brown criterion
	Engineering Nonspherical Hollow Structures with Complex Interiors by Template-Engaged Redox Etching 期刊论文 OAI收割 JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2010, 卷号: 132, 期号: 45, 页码: 16271-16277 作者: Wang, Zhiyu; Luan, Deyan; Li, Chang Ming; Su, Fabing; Madhavi, Srinivasan 收藏 \| 浏览/下载：81/0 \| 提交时间：2013/11/28 enhanced photocatalytic activity shell nanostructures spherical colloids lithium storage cavity size spheres nanoparticles fabrication cu2o nanocrystals
	Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE) 会议论文 OAI收割 ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China 作者: Zhang G.; Zhang G.; Zhang G.; Zhang J.; Zhang J. 收藏 \| 浏览/下载：23/0 \| 提交时间：2013/03/25 The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting when the cutting velocity equals 100mm/min while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow rapid cutting speed the cutting quality meets the expecting demand. fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence a /4 waveplate to compensate heat -induced birefraction utilize the Nd:YAG self- aperture effect more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens double axis linear step motor positioning system suitable beam expander multiplying factor appropriate diameter of exit beam aperture proper repetition rate when the cutting velocity equals 400mm/min 0.75mm thick silicon wafer can be penetrated