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长春光学精密机械与物... [4]
半导体研究所 [1]
西安光学精密机械研究... [1]
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OAI收割 [6]
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会议论文 [5]
期刊论文 [1]
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2021 [1]
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半导体材料 [1]
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Novel Structure Design of Circle Support Component for a Primary Reflective Mirror with Large Diameter
会议论文
OAI收割
Chengdu, China, 2021-06-14
作者:
Song, Yang
;
Ye, Jing
;
Shen, Zhong
;
Ma, Tengfei
;
Hu, Yongming
  |  
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2022/03/10
primary reflective mirror
circle support component
special structural layout
assembling method
Accuracy synthesis of a 3-RPS parallel robot based on manufacturing costs (EI CONFERENCE)
会议论文
OAI收割
31st Chinese Control Conference, CCC 2012, July 25, 2012 - July 27, 2012, Hefei, China
Yao T.-K.
;
Xi Z.
;
Feng Z.
;
Zhang L.-M.
;
Yong W.
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2013/03/25
Pose accuracy is an important issue for parallel robot being used as mirror supporting system of telescope. One challenging topic is the accuracy synthesis which deals with the optimal design of the manufacturing and assembling tolerances of each component under the given pose accuracy. First
the error model of the 3-RPS parallel robot is built based on total derivation of the kinematic equations. And the error variable of each spherical or rotate joint can be expressed as a single boundary error parameter but not three independent position parameters. Then
the accuracy synthesis model is formulated taking the manufacturing costs as the optimization objective and the accuracy requirements as the constraint condition. Finally
the genetic algorithm is used to solve the optimization problem and a simulation example is given. The results show that the accuracy synthesis method based on manufacturing costs can satisfy the need of pose accuracy and is better for engineering application than the method based on error sensitivity. 2012 Chinese Assoc of Automati.
Modular aircraft simulation platform based on simulink (EI CONFERENCE)
会议论文
OAI收割
2010 IEEE International Conference on Mechatronics and Automation, ICMA 2010, August 4, 2010 - August 7, 2010, Xi'an, China
Chen C.-Q.
;
Ji Y.
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2013/03/25
Aircraft simulation platform is the most important supporting technology in the aircraft development process. This simulation platform can be used for validating the design of subsystem and also it provides the necessary data for the Aircraft design. Wind has great impact on the flight parameter. In order to accurately simulate the wind model and calculate the flight parameters
a simulation modeling method for flight parameter simulation platform under wind field environment is established. Firstly
the various sub-systems which affecting flight parameters are analyzed
some mathematical models of the flight parameter simulation platform is established. Secondly
the atmospheric wind field is studied to analyze the impact on its trajectory. Then the model is built in the Simulink toolbox in the Matlab which is based on the principles of hierarchy and modularity
using C MEX S-function for the complex kinetic equations. Finally
when the models have been established
encapsulating models for several subsystem and assembling them for the Aircraft simulation platform based on the unified interface. The simulation tests (including the performance test of a certain gliding Aircraft
the wind influence test of a certain uncontrolled aircraft) prove the simulation capability of the platform
and its calculating step can reach 1 ms. Comparing simulation with field test data of a certain uncontrolled aircraft
it shows that the relative deviation of range is 0.47%
the relative deviation of maximal altitude is 2.1%. Taking relevant standards as a reference standard
it is demonstrated the platform is reliable
meets the engineering accuracy requirements. 2010 IEEE.
Data preprocessing of the exterior field of vision assembling photogrammetric camera (EI CONFERENCE)
会议论文
OAI收割
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, July 8, 2007 - July 12, 2007, Chengdu, China
作者:
Li J.
;
Li J.
;
Li J.
;
Liu J.
;
Liu J.
收藏
  |  
浏览/下载:72/0
  |  
提交时间:2013/03/25
Transmit array photogrammetric camera can obtain image which is high geometric fidelity and high photogrammetric quality. However
the single chip array CCD image sensor camera can't meet the need of measuring precision and photogrammetric covering area. In order to obtain large numbers of information and extensive photogrammetric covering area
we must increase field of vision angle and improve photogrammetric covering area. And all these objects can be realized by exterior field of vision assembling photogrammetric camera. Two side work must be done before images
which obtained by exterior field of vision assembling photogrammetric camera
be used in photogrammetry. First
all assembling camera focal plane need be converted to a benchmark coordinate focal plane to realize camera digital assembling. Second
images must be re-sampled and processing. Because of coordinate conversion
two images from different assembling cameras can be established function relation
which a pixel of image from a camera is corresponding to a pixel of another image from different camera. But through this conversion
some pixels maybe extrusion together and other pixels separate on an image area. So interpolation direction finding(IDF) is used to obtain these pixels and realize image re-sampling. In this paper
the structure of exterior field of vision assembling photogrammetric camera is analyzed
and the coordinate conversion method of exterior field of vision assembling photogrammetric camera and image gray re-sampling method also can be discussed. All the works are based to data pretreatment of exterior vision assembling photogrammetric camera.
Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE)
会议论文
OAI收割
MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China
作者:
Wang W.
;
Wang L.
;
Wang L.
;
Wang L.
;
Chen W.
收藏
  |  
浏览/下载:30/0
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提交时间:2013/03/25
We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges
Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment
thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in
sixteen V-grooves for optical fibers
and micropits for micro ball lenses
all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners
where different geometries meet. Through this assembling method
the fiber
micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.
Progress of Si-based nanocrystalline luminescent materials
期刊论文
OAI收割
chinese science bulletin, 2002, 卷号: 47, 期号: 15, 页码: 1233-1242
Peng YC
;
Zhao XW
;
Fu GS
收藏
  |  
浏览/下载:100/0
  |  
提交时间:2010/08/12
Si-based nanomaterials
fabricated method
structural characterization
light emitting mechanism
Si-based photoelectronic devices
CHEMICAL-VAPOR-DEPOSITION
SELF-ASSEMBLING FORMATION
SILICON QUANTUM DOTS
LASER-ABLATION
OPTICAL-ABSORPTION
POROUS SILICON
LIGHT-EMISSION
PHOTOLUMINESCENCE
FABRICATION
OXYGEN