中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
金属研究所 [7]
化学研究所 [1]
过程工程研究所 [1]
海洋研究所 [1]
武汉岩土力学研究所 [1]
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OAI收割 [11]
内容类型
期刊论文 [10]
CNKI期刊论文 [1]
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2022 [2]
2019 [1]
2014 [1]
2008 [3]
2007 [1]
2006 [1]
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学科主题
Constructi... [1]
Materials ... [1]
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Microstructure and electrical conductivity of electroless copper plating layer on magnesium alloy micro-arc oxidation coating
期刊论文
OAI收割
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2022, 卷号: 32, 期号: 12, 页码: 3950-3962
作者:
Li, Tao
;
Leng, Zhong-jun
;
Wang, Xi-tao
;
Wang, Shi-fang
;
Zhang, Su-qing
  |  
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2024/01/07
electroless copper plating
electrical conductivity
MAO coating
magnesium alloy
Effect of electroless plating time and temperature on the formation and antibacterial ability of Cu-plated cement-based material
期刊论文
OAI收割
CEMENT & CONCRETE COMPOSITES, 2022, 卷号: 131
作者:
Liang, Yunchao
;
Chu, Hongqiang
;
Zeng, Youxu
;
Guo, Ming-Zhi
;
Song, Zijian
  |  
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2023/08/02
Microbial induced corrosion
Cement paste
Electroless plating
Copper
Antibacterial material
Preparation of low-fouling reverse-osmosis membranes on an Al_2O_3 carrier for desalination exploratory research
CNKI期刊论文
OAI收割
2019
作者:
Meng Zheng
;
Jing Wang
;
Baorong Hou
  |  
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2024/12/18
Low-fouling
MFI zeolite membrane
Porous alumina ceramics
Electroless copper plating
Desalination
Erosion-Corrosion Behavior of Electroless Ni-P Coating on Copper-Nickel Alloy in 3.5 wt.% Sodium Chloride Solution
期刊论文
OAI收割
Journal of Materials Engineering and Performance, 2014, 卷号: 23, 期号: 1, 页码: 230-237
B. Jiang
;
S. L. Jiang
;
A. L. Ma
;
Y. G. Zheng
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2014/03/14
copper-nickel alloy
electroless
erosion-corrosion resistance
heat
treatment
passivity
plating
electrochemical-behavior
composite coatings
nacl solutions
seawater
resistance
velocity
cu
A novel method of electroless plating on AZ31 magnesium alloy sheet
期刊论文
OAI收割
Journal of Materials Processing Technology, 2008, 卷号: 203, 期号: 1-3, 页码: 310-314
H. Zhao
;
Z. H. Huang
;
J. Z. Cui
收藏
  |  
浏览/下载:23/0
  |  
提交时间:2012/04/13
organic coating
interlayer
electroless plating
copper film
corrosion
copper
az91d
substrate
coatings
silver
films
Novel in situ method (vacuum assisted electroless plating) modified porous cathode for solid oxide fuel cells
期刊论文
OAI收割
Electrochemistry Communications, 2008, 卷号: 10, 期号: 6, 页码: 844-847
R. Su
;
Z. Lu
;
K. F. Chen
;
N. Ai
;
S. Y. Li
;
B. Wei
;
W. H. Su
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2012/04/13
in situ
vacuum assisted electroless plating
silver
SOFC
cathode
it-sofcs
performance
deposition
copper
Electroless plating of copper on AZ31 magnesium alloy substrates
期刊论文
OAI收割
Microelectronic Engineering, 2008, 卷号: 85, 期号: 2, 页码: 253-258
H. Zhao
;
Z. H. Huang
;
J. Z. Cui
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2012/04/13
organic coatings
copper film
electroless plating
corrosion
corrosion
coatings
films
deposits
silver
Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder
期刊论文
OAI收割
Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 6, 页码: 811-816
J. J. Guo
;
L. Zhang
;
A. P. Xian
;
J. K. Shang
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2012/04/13
solderability
FeNi alloys
lead-free solders
wetting
electroless-nickel/solder interface
enig plating layer
thermal-stability
sn-0.4cu solder
cu substrate
plated kovar
sn
reflow
copper
part
Inhibition effect of self-assembled films formed by gold nanoparticles on iron surface
期刊论文
OAI收割
Applied Surface Science, 2006, 卷号: 252, 期号: 12, 页码: 4327-4334
H. F. Ma
;
S. H. Chen
;
G. Z. Liu
;
J. Xu
;
M. Zhou
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2012/04/14
gold nanoparticles
self-assembled films
electrochemical impedance
spectroscopy (EIS)
nickel electroless plating
ortho-substituted anilines
silver nanoparticles
copper corrosion
protection
alkanethiol
Electroless copper coating on nickel foils in super-gravity field
期刊论文
OAI收割
MATERIALS LETTERS, 2005, 卷号: 59, 期号: 6, 页码: 667-670
作者:
Gong, YP
;
Guo, ZC
;
Lu, WC
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2013/10/25
super-gravity
electroless copper plating
plating rate
rotational speed