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Manufacturing and testing of the line-array fiber-optic image slicer based on silicon V-grooves (EI CONFERENCE) 会议论文  OAI收割
MEMS/MOEMS Technologies and Applications III, November 12, 2007 - November 14, 2007, Beijing, China
作者:  
Zhu Y.
收藏  |  浏览/下载:22/0  |  提交时间:2013/03/25
Linear fiber-optic image slicer is used more and more in spatial exploration and imaging system. In this paper  a plane arranging method of fiber-optic array based on Si-V grooves is established in order to improve the accuracy and reduce the cost of manufacturing. Firstly  the Si-V groove array is micro-machined with anisotropic etching process  then optical fibers are placed in the grooves orderly with plane arranging method. Secondly  the end surfaces of the device are polished  also the linear fiber-optic image slicer is packaged. Finally  some parameters are tested  including structure parameters  transmittivity and vibration test. Experimental results indicate that the maximum error accumulated in 2000 periods of the Si-V grooves is 0.5 m  the error of the height in Si-V grooves is less than 0.15m  the roughness of the end surface is less than 0.9nm. The transmittivity of the linear fiber-optic image slicer that without optical film is 51.46% at the wavelength of 632.8nm. After random vibration experiment  the ratio of the broken fiber increased by 0.1%. While the temperature reached 320C  the stress of epoxy will be 130Mpa  which is close to the limit resistance stress of 139Mpa  some cracks appeared.  
Research on micro-optical lenses fabrication technology 期刊论文  OAI收割
optik, 2007, 卷号: 118, 期号: 8, 页码: 395-401
作者:  
Li Yulin;  Li Tonghai;  Jiao Guohua;  Hu Baowen;  Huo Junmin
收藏  |  浏览/下载:120/2  |  提交时间:2010/01/12
Study on the fabrication of orange micro-LED arrays for display (EI CONFERENCE) 会议论文  OAI收割
ICO20: Display Devices and Systems, August 21, 2005 - August 26, 2005, Changchun, China
作者:  
Li J.;  Wang W.;  Wang W.;  Zhao L.;  Li J.
收藏  |  浏览/下载:32/0  |  提交时间:2013/03/25
Arrays of micro-sized LEDs which can be used as microdisplays have been demonstrated in recent years. In order to reduce the input and output connections to the arrays  we employ a matrix addressable architecture  in which all the pixels in each row are connected by a common metal line on the top of the window layer (top electrode) or at the base of substrate(bottom electrode). Decreasing the size of electrodes makes for minimizing the size of device. The optic and electric isolation and good ohmic contact are also helpful to obtain superior optical and electrical performance. We describe a procedure of fabrication of AlGalnP-based orange micro-LED by wet etching. The structure of devices is etched using both isotropic and anisotropic etchant. The pixel size is about 16um 20um  and there are 1000 818 pixels in the light emitting chip whose diagonal is 1-in.