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	Mechanical interleaving assembly of TDICCD focal plane for space camera (EI CONFERENCE) 会议论文 OAI收割 ICO20: Optical Devices and Instruments, August 21, 2005 - August 26, 2005, Changchun, China 作者: Ren J.-Y.; Zhang X.-X. 收藏 \| 浏览/下载：25/0 \| 提交时间：2013/03/25 TDICCD assembly is a major method of acquiring wide field for space camera. For the demand of space camera's wide view field and high resolution the technique of mechanical interleaving assembly is discussed. Its principle method of adjusting and testing as well as the structure of focal plane are described. Using mechanical tangent-screws adjusting method the assembly with TDI CCDs for wide field space camera focal plane is finished on the facility which is composed of a long work-distance microscope and a negative pressure and adsorption guide apparatus. The assembly length of TDICCD focal plane for wide field space camera reaches 560mm and the measuring error is not more than 3.2 m the mechanical interleaving assembly method has effect of zero clearance and can achieve good image quality.
	Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE) 会议论文 OAI收割 ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China 作者: Zhang G.; Zhang G.; Zhang G.; Zhang J.; Zhang J. 收藏 \| 浏览/下载：24/0 \| 提交时间：2013/03/25 The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting when the cutting velocity equals 100mm/min while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow rapid cutting speed the cutting quality meets the expecting demand. fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence a /4 waveplate to compensate heat -induced birefraction utilize the Nd:YAG self- aperture effect more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens double axis linear step motor positioning system suitable beam expander multiplying factor appropriate diameter of exit beam aperture proper repetition rate when the cutting velocity equals 400mm/min 0.75mm thick silicon wafer can be penetrated
	Empty container management in a port with long-run average criterion 期刊论文 OAI收割 MATHEMATICAL AND COMPUTER MODELLING, 2004, 卷号: 40, 期号: 1-2, 页码: 85-100 作者: Li, JA; Liu, K; Leung, SCH; Lai, KK \| 收藏 \| 浏览/下载：9/0 \| 提交时间：2018/07/30 containerization problem inventory negative demand Markov decision process