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CAS IR Grid
机构
金属研究所 [1]
长春光学精密机械与物... [1]
采集方式
OAI收割 [2]
内容类型
会议论文 [1]
期刊论文 [1]
发表日期
2009 [1]
2005 [1]
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Wettability and interfacial behaviour of NdF3-LiF-Nd2O3 on TiB2-based ceramics
期刊论文
OAI收割
JOURNAL OF RARE EARTHS, 2009, 卷号: 27, 期号: 3, 页码: 381-384
作者:
Luo Xudong
;
Wang Zhaowen
;
Hu Xianwei
;
Gao Bingliang
;
Shi Zhongning
  |  
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2021/02/02
MECHANICAL-PROPERTIES
TIB2 CERAMICS
MICROSTRUCTURE
OXIDATION
CORROSION
wetting
titanium diboride
penetrated layer
oxidization
rare earths
Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE)
会议论文
OAI收割
ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China
作者:
Zhang G.
;
Zhang G.
;
Zhang G.
;
Zhang J.
;
Zhang J.
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2013/03/25
The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting
when the cutting velocity equals 100mm/min
while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth
double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow
rapid cutting speed
the cutting quality meets the expecting demand.
fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power
using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence
a /4 waveplate to compensate heat -induced birefraction
utilize the Nd:YAG self- aperture effect
more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens
double axis linear step motor positioning system
suitable beam expander multiplying factor
appropriate diameter of exit beam aperture
proper repetition rate
when the cutting velocity equals 400mm/min
0.75mm thick silicon wafer can be penetrated