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浏览/检索结果: 共118条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Genesis of the Late Cretaceous mafic-intermediate intrusions in the giant Gejiu Sn-Cu ore field and its metallogenic significance 期刊论文  OAI收割 ORE GEOLOGY REVIEWS, 2024, 卷号: 170, 页码: 17 作者:  Xie, Shixiong;  Deng, Mingguo;  Huang, Wenting;  Liang, Huaying;  Chen, Xilian   |  收藏  |  浏览/下载：16/0  |  提交时间：2024/09/13 Gejiu Sn-Cu ore field  Mafic-intermediate intrusions  Magmatic-metallogenic event  Tectonic setting  Late Cretaceous   Mineralogy of indium mineralization in the Dajing Sn-Cu polymetallic deposit in Inner Mongolia 期刊论文  OAI收割 ORE GEOLOGY REVIEWS, 2023, 卷号: 159, 页码: 19 作者:  Ye, Zi;  Xu, Jing;  Zhao, Junfeng;  Chen, Suyu;  Chen, Jingwen   |  收藏  |  浏览/下载：5/0  |  提交时间：2024/08/23 Indium  Occurrence  Sphalerite  Mineralogy  Dajing Sn -Cu polymetallic deposit   Strengthening and toughening mechanisms of P-rich phase in Cu-4Sn-P alloy wire 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2023, 卷号: 937, 页码: 12 作者:  Duan, Xin-Rong;  Chen, Yan;  Hong, Zhi-Yuan;  Wang, Song-Wei;  Chen, Shuai-Feng   |  收藏  |  浏览/下载：26/0  |  提交时间：2023/05/09 Cu-Sn-P alloy  Cold drawing  Microstructure evolution  Strengthening mechanism   Residual stress and precipitation of Mg-5Zn-3.5Sn-1Mn-0.5Ea-0.5Cu alloy with different quenching rates 期刊论文  OAI收割 JOURNAL OF MAGNESIUM AND ALLOYS, 2021, 卷号: 9, 期号: 2, 页码: 604-612 作者:  Wang, Cong;  Luo, Tianjiao;  Liu, Yunteng;  Huang, Qiuyan;  Yang, Yuansheng   |  收藏  |  浏览/下载：49/0  |  提交时间：2021/10/15 Mg-5Zn-3.5Sn-1Mn-0.5Ca-0.5Cu alloy  Solution treatment  Quenching rate  Residual stress  Precipitation  Age-hardening   Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9 作者:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：17/0  |  提交时间：2021/02/02 Cu-Sn IMC  Growth behavior  External stress effect  Isothermal aging   Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 4, 页码: 9 作者:  Tian, Feifei;  Pang, Xueyong;  Xu, Bo;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：34/0  |  提交时间：2021/02/02 In-48Sn solder  polycrystalline Cu  Cu-2(In  Sn)  growth orientation   Influence of interface electric field on interaction between molten iron and refractory interface 期刊论文  OAI收割 CERAMICS INTERNATIONAL, 2020, 卷号: 46, 期号: 8, 页码: 10180-10185 作者:  Yang, Xin;  He, Zhijun;  Yu, Jingkun;  Zhang, Yuanyuan;  Yuan, Lei   |  收藏  |  浏览/下载：51/0  |  提交时间：2020/12/16 WETTING BEHAVIOR  WETTABILITY  CU  KINETICS  SN  MORPHOLOGY  MECHANISM  NOZZLE  AL   Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者:  Zhang, Qingke   |  收藏  |  浏览/下载：60/0  |  提交时间：2020/12/16 LEAD-FREE SOLDERS  INTERMETALLIC COMPOUNDS  LIQUID SN  KINETICS  GROWTH  CU6SN5  METALLIZATION   Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文  OAI收割 SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444 作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei   |  收藏  |  浏览/下载：114/0  |  提交时间：2021/02/02 Sn-Cu  microstructures  IMC  mechanical properties   Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan   |  收藏  |  浏览/下载：145/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength