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	Microstructure control and hot cracking behavior of the new Ni-Co based superalloy prepared by electron beam smelting layered solidification technology 期刊论文 OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2024, 卷号: 175, 页码: 55-71 作者: Cui, Hongyang; Tan, Yi; Ning, Lidan; Bai, Rusheng; You, Xiaogang \| 收藏 \| 浏览/下载：62/0 \| 提交时间：2024/01/08 Electron beam smelting layered solidification technology CET Thermal cycling Hot cracking
	Development of Low Segregation Technology 期刊论文 OAI收割 ACTA METALLURGICA SINICA, 2017, 卷号: 53, 期号: 5, 页码: 559-566 作者: Zhang Yutuo; Chen Bo; Liu Kui; Li Dianzhong; Li Yiyi \| 收藏 \| 浏览/下载：22/0 \| 提交时间：2021/02/02 segregation low segregation technology minor element solidification interval
	Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文 OAI收割 Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596 L. M.; Zhang Yang, Z. F. 收藏 \| 浏览/下载：27/0 \| 提交时间：2015/05/08 Intermetallic compounds (IMC) solder joint cooling rate solidification adsorption ag-cu solder cu6sn5 grains in-situ sn alloy nanoparticles ag3sn microstructure technology particles
	Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation 期刊论文 OAI收割 INTERMETALLICS, 2015, 卷号: 58, 页码: 84—90 作者: Wang, TM; Zhou, P; Cao, F; Kang, HJ; Chen, ZN 收藏 \| 浏览/下载：22/0 \| 提交时间：2015/12/09 LEAD-FREE SOLDER INTERFACIAL REACTIONS IMAGING TECHNOLOGY CURRENT-DENSITY ZN ADDITION MICROSTRUCTURE ALLOYS NI SOLIDIFICATION IMPROVEMENT
	Quantitative assessment of urban expansion impact on comprehensive productivity of cultivated land in Tangshan city based on RS and GIS EI期刊论文 OAI收割 2009 Men Mingxin; Chen Yaheng; Liu Yu; Wei Liang; Xu Hao 收藏 \| 浏览/下载：16/0 \| 提交时间：2012/06/11 Agricultural machinery Agriculture Expansion Geographic information systems Land use Rapid solidification Regression analysis Remote sensing Technology transfer Urban planning