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Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
金属研究所 [11]
力学研究所 [4]
数学与系统科学研究院 [1]
过程工程研究所 [1]
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OAI收割 [17]
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期刊论文 [17]
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2023 [1]
2022 [1]
2018 [1]
2016 [1]
2014 [2]
2013 [3]
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Materials ... [1]
Metallurgy... [1]
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交叉与边缘领域的力学 [1]
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Crack suppression in electrodeposited brass film through controlling growth stresses by co-depositing with Bi
期刊论文
OAI收割
THIN SOLID FILMS, 2023, 卷号: 777, 页码: 9
作者:
Li, Ronghui
;
Guan, Yishan
;
Fan, Qinna
  |  
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2024/01/07
Growth stress
Brass
Thin film
Bismuth
Stacking faults
Cracking
Crack free
Electrodeposition
The thin-wall debit of a typical cast polycrystalline M951 alloy
期刊论文
OAI收割
PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL, 2022, 卷号: 32, 期号: 1, 页码: 104-113
作者:
Li, Qi
;
Xie, Jun
;
Yu, JinJiang
;
Shu, Delong
;
Hou, Guichen
  |  
收藏
  |  
浏览/下载:53/0
  |  
提交时间:2022/07/01
M951
Thin-wall debit
Surface crack
Through-grain boundary
Enhancing fatigue strength of high-strength ultrafine-scale Cu/Ni laminated composites
期刊论文
OAI收割
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 714, 页码: 43-48
作者:
Wang, YC
;
Liang, F
;
Tan, HF
;
Zhang, B
;
Zhang, GP
  |  
收藏
  |  
浏览/下载:45/0
  |  
提交时间:2018/06/05
Dissimilar Elastic-materials
High-cycle Fatigue
Mems Thin-films
Crack Deflection
Copper-films
Nanocrystalline Metals
Length-scale
Liga Nickel
Behavior
Fine
EDDY CURRENT MODEL FOR NONDESTRUCTIVE EVALUATION WITH THIN CRACKS
期刊论文
OAI收割
SIAM JOURNAL ON SCIENTIFIC COMPUTING, 2016, 卷号: 38, 期号: 2, 页码: A973-A996
作者:
Jiang, Xue
;
Li, Peijun
;
Zheng, Weiying
  |  
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2018/07/30
eddy current problem
Maxwell's equations
finite element method
nondestructive evaluation
thin crack
Electrodeposited free-crack NiW films under super gravity filed: Structure and excellent corrosion property
期刊论文
OAI收割
MATERIALS CHEMISTRY AND PHYSICS, 2014, 卷号: 148, 期号: 1-2, 页码: 245-292
作者:
Wang, Mingyong
;
Wang, Zhi
;
Guo, Zhancheng
收藏
  |  
浏览/下载:168/0
  |  
提交时间:2014/11/02
Corrosion
Alloys
Crack
Thin films
Geometrical Scale-Sensitive Fatigue Properties of Ti-6.5Al-3.5Mo-1.5Zr-0.3Si Alloys With alpha/beta Lamellar Microstructures
期刊论文
OAI收割
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 12, 页码: 1284-1288
B.
;
Song Zhang, Z. M.
;
Lei, L. M.
;
Kang, L.
;
Zhang, G. P.
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2015/05/08
Fatigue
Ti alloy
Microstructure
Size effect
thin copper
titanium-alloys
cycle fatigue
crack growth
foils
ti-6al-4v
films
wires
size
High-temperature thermal stability of nanocrystalline Cr2O3 films deposited on silicon wafers by arc ion plating
期刊论文
OAI收割
Surface & Coatings Technology, 2013, 卷号: 228, 页码: 140-147
T. G. Wang
;
Y. M. Liu
;
H. Sina
;
C. M. Shi
;
S. Iyengar
;
S. Melin
;
K. H. Kim
收藏
  |  
浏览/下载:32/0
  |  
提交时间:2013/12/24
Cr2O3 film
Arc ion plating
Bias voltage
Thermal stability
Crack area
percentage
Grain size
fatigue crack initiation
chromium-oxide coatings
p/m super-alloys
thin-films
mechanical-properties
vapor-deposition
wear-resistance
crn coatings
oxidation
microstructure
Fatigue Damage Behavior of Freestanding 40 mu m-Thick Nickel Foils for MEMS Applications
期刊论文
OAI收割
Advanced Engineering Materials, 2013, 卷号: 15, 期号: 6, 页码: 496-502
J. Xu
;
G. P. Zhang
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2013/12/24
crack initiation
thin copper
films
On size effects on fatigue properties of metal foils at micrometer scales
期刊论文
OAI收割
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 575, 页码: 217-222
C. Y. Dai
;
B. Zhang
;
J. Xu
;
G. P. Zhang
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2013/12/24
Copper foil
Strength
Plasticity
Fatigue
Size effect
alloy thin-film
fracture properties
crack growth
copper foils
wires
mems
nanoscale
strength
behavior
tests
Surface initiated polymerization from integrated poly(dimethylsiloxane) enables crack-free large area wrinkle formation
期刊论文
OAI收割
POLYMERS FOR ADVANCED TECHNOLOGIES, 2012, 卷号: 23, 期号: 9, 页码: 1240-1245
作者:
Li Z
;
Zhang S
收藏
  |  
浏览/下载:32/0
  |  
提交时间:2013/01/18
wrinkle
poly(dimethylsiloxane)
surface initiated polymerization
dynamics
crack-free
Thin-Films
Patterns
Electronics