中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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  • 长春光学精密机械与物... [6]
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  • 会议论文 [6]
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The packaging technology of optical switch arrays (EI CONFERENCE) 会议论文  OAI收割
ICO20: MEMS, MOEMS, and NEMS, August 21, 2005 - August 26, 2005, Changchun, China
作者:  
Chen W.;  Wang W.;  Zhao L.;  Wang W.;  Wang L.
收藏  |  浏览/下载:13/0  |  提交时间:2013/03/25
The masks fabricated by UV LIGA for excimer laser ablation and X-ray lithography 会议论文  OAI收割
2004
Liang J. Q.; Le Z. C.; Wang W. B.; Peng L. Q.; Lan W. H.; Ming A. J.; Ye J.; Quan B. S.; Yao J. S.; Xuan M.; Wang L. J.
收藏  |  浏览/下载:9/0  |  提交时间:2013/03/28
The study on the compound X-ray refractive lens using LIGA technique (EI CONFERENCE) 会议论文  OAI收割
MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China
作者:  
Wang L.;  Wang L.;  Wang L.;  Wang W.;  Wang W.
收藏  |  浏览/下载:14/0  |  提交时间:2013/03/25
The study on the compound X-ray refractive lens using LIGA technique 会议论文  OAI收割
2004
Liang J. Q.; Le Z. C.; Peng L. Q.; Wang W. B.; Lan W. H.; Ming A. J.; Yi F. T.; Ye J.; Quan B. S.; Yao J. S.; Xuan M.; Wang L. J.
收藏  |  浏览/下载:11/0  |  提交时间:2013/03/28
Study on optical parts of MOEMS optical switch with low insertion loss 会议论文  OAI收割
2004
Ming A. J.; Liang J. Q.; Lan W. H.; Dong W.; Yao J. S.; Wang W. B.; Le Z. C.; Chen W. Y.; Wang L. J.
收藏  |  浏览/下载:9/0  |  提交时间:2013/03/28
Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文  OAI收割
MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China
作者:  
Wang W.;  Wang L.;  Wang L.;  Wang L.;  Chen W.
收藏  |  浏览/下载:22/0  |  提交时间:2013/03/25
We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.