机构

• 西安光学精密机械研究... [3]

采集方式

• OAI收割 [3]

内容类型

• 会议论文 [3]

发表日期

• 2016 [3]

学科主题

• semiconduc... [3]
• computer a... [2]
• lasers, ge... [2]
• light/opti... [2]
• numerical ... [2]
• thermodyna... [2]
• 更多

筛选

浏览/检索结果: 共3条，第1-3条 帮助 限定条件 学科主题：semiconductor lasers     条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 A compact QCW conduction-cooled high power semiconductor laser array 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang 收藏  |  浏览/下载：25/0  |  提交时间：2016/11/22 Chip scale packages  Electronics packaging  Finite element method  High power lasers  High temperature applications  Temperature   Thermal behavior of microchannel cooled high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei 收藏  |  浏览/下载：30/0  |  提交时间：2016/11/22 Computational fluid dynamics  Copper  Crosstalk  Diodes  Electronics packaging  Finite element method  Flow of water  Heat resistance  Heat sinks  Hydraulics  Laser beam welding  Microchannels  Numerical methods  Optical properties  Power semiconductor diodes  Reliability  Thermodynamic properties   Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling 收藏  |  浏览/下载：39/0  |  提交时间：2016/11/22 Computer simulation  Electronics packaging  High power lasers  Numerical models  Occupational risks  Optical properties  Packaging  Power semiconductor diodes  Shear stress  Thermal stress