机构

• 西安光学精密机械研究... [8]

采集方式

• OAI收割 [8]

内容类型

• 会议论文 [5]
• 期刊论文 [3]

发表日期

• 2018 [1]
• 2017 [3]
• 2016 [3]
• 2013 [1]

学科主题

• semiconduc... [3]
• computer a... [2]
• lasers, ge... [2]
• light/opti... [2]
• numerical ... [2]
• thermodyna... [2]
• 更多

筛选

浏览/检索结果: 共8条，第1-8条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829 作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai   |  收藏  |  浏览/下载：73/0  |  提交时间：2018/05/31 Component Architectures  Semiconductor Device Packaging   Thermal characteristics of kW-level conduction-cooled semiconductor laser array 期刊论文  OAI收割 Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering, 2017, 卷号: 46, 期号: 10 作者:  Zhu, Qiwen;  Zhang, Pu;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling   |  收藏  |  浏览/下载：59/0  |  提交时间：2017/12/30 Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文  OAI收割 components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31 作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai 收藏  |  浏览/下载：76/0  |  提交时间：2017/06/08 Optimization of microchannel cooler of high power diode laser array package 会议论文  OAI收割 components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31 作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei 收藏  |  浏览/下载：14/0  |  提交时间：2017/06/08 A compact QCW conduction-cooled high power semiconductor laser array 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang 收藏  |  浏览/下载：25/0  |  提交时间：2016/11/22 Chip scale packages  Electronics packaging  Finite element method  High power lasers  High temperature applications  Temperature   Thermal behavior of microchannel cooled high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei 收藏  |  浏览/下载：30/0  |  提交时间：2016/11/22 Computational fluid dynamics  Copper  Crosstalk  Diodes  Electronics packaging  Finite element method  Flow of water  Heat resistance  Heat sinks  Hydraulics  Laser beam welding  Microchannels  Numerical methods  Optical properties  Power semiconductor diodes  Reliability  Thermodynamic properties   Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling 收藏  |  浏览/下载：39/0  |  提交时间：2016/11/22 Computer simulation  Electronics packaging  High power lasers  Numerical models  Occupational risks  Optical properties  Packaging  Power semiconductor diodes  Shear stress  Thermal stress   Double-cutting beam shaping technique for high-power diode laser area light source 期刊论文  OAI收割 optical engineering, 2013, 卷号: 52, 期号: 10 作者:  Huang, Zhihua;  Xiong, Lingling;  Liu, Hui;  Wang, Zhenfu;  Zhang, Pu 收藏  |  浏览/下载：27/0  |  提交时间：2014/09/17 beam shaping  beam parameter product  laser diode  fiber coupling