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Soft Magnetic Skin's Deformation Analysis for Tactile Perception

文献类型：期刊论文

作者Gui, Mei-Jiang3,4; Zhou, Xiao-Hu3,4; Xie, Xiao-Liang3,4; Liu, Shi-Qi3,4; Feng, Zhen-Qiu3,4; Hou, Zeng-Guang1,2,3,4
刊名IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
出版日期2023-12-01
卷号70期号:12页码:12883-12893
ISSN号0278-0046
关键词Soft magnetic skins deformations analy-sis dynamic Young's modulus (DYM) finite-element simu-lation tactile perception
DOI10.1109/TIE.2022.3232669
通讯作者Zhou, Xiao-Hu(xiaohu.zhou@ia.ac.cn) ; Hou, Zeng-Guang(zengguang.hou@ia.ac.cn)
英文摘要Soft magnetic skins have been widely adopted for tactile perception due to their high accuracy and simple wiring advantages. However, the perceptual properties of magnetic skins are limited by information mapping relationships with weak interpretation. To overcome existing limitations, dynamic Young's modulus (DYM) is proposed in this article based on the strain energy density function to precisely describe the compression stiffness of magnetic skins. Furthermore, a highly interpretable and broadly applicable method is derived using DYM to analyze a cylindrical magnetic skin's deformation process as the skin deformed under external mechanic load. Extensive experiments in simulated and real situations with different deformations are carried out to verify the proposed method. Experimental results demonstrate that 0.14% and 0.43% relative errors in simulated and real environments, respectively, can be reached. Moreover, the proposed method can achieve minimum errors in almost all situations than data-driven or state-of-the-art analysis approaches. And the generality of the proposed method is validated by experiments conducted on skins with two different shapes. These promising results indicate the potential of the proposed method in establishing practical information mapping relationships for magnetic skins, probably addressing the significant challenges for magnetic skin application in complex scenarios.
WOS关键词SENSOR
资助项目National Natural Science Foundation of China[62003343] ; National Natural Science Foundation of China[62222316] ; National Natural Science Foundation of China[U1913601] ; National Natural Science Foundation of China[62073325] ; National Natural Science Foundation of China[61720106012] ; National Natural Science Foundation of China[U20A20224] ; National Natural Science Foundation of China[U1913210] ; Beijing Natural Science Foundation[M22008] ; Youth Innovation Promotion Association of Chinese Academy of Sciences (CAS)[2020140] ; Strategic Priority Research Program of CAS[XDB32040000] ; Beijing Science and Technology Program[Z211100007921021]
WOS研究方向Automation & Control Systems ; Engineering ; Instruments & Instrumentation
语种英语
出版者IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
WOS记录号WOS:001013415800096
资助机构National Natural Science Foundation of China ; Beijing Natural Science Foundation ; Youth Innovation Promotion Association of Chinese Academy of Sciences (CAS) ; Strategic Priority Research Program of CAS ; Beijing Science and Technology Program
源URL[http://ir.ia.ac.cn/handle/173211/54122]  
专题多模态人工智能系统全国重点实验室
通讯作者Zhou, Xiao-Hu; Hou, Zeng-Guang
作者单位1.CAS Ctr Excellence Brain Sci & Intelligence Techno, Beijing 100190, Peoples R China
2.Macau Univ Sci & Technol, Inst Syst Engn, Joint Lab Intelligence Sci & Technol, Macau 999078, Peoples R China
3.Chinese Acad Sci, Inst Automat, State Key Lab Management & Control Complex Syst, Beijing 100190, Peoples R China
4.Univ Chinese Acad Sci, Sch Artificial Intelligence, Beijing 100049, Peoples R China
推荐引用方式
GB/T 7714		 Gui, Mei-Jiang,Zhou, Xiao-Hu,Xie, Xiao-Liang,et al. Soft Magnetic Skin's Deformation Analysis for Tactile Perception[J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,2023,70(12):12883-12893.
APA Gui, Mei-Jiang,Zhou, Xiao-Hu,Xie, Xiao-Liang,Liu, Shi-Qi,Feng, Zhen-Qiu,&Hou, Zeng-Guang.(2023).Soft Magnetic Skin's Deformation Analysis for Tactile Perception.IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,70(12),12883-12893.
MLA Gui, Mei-Jiang,et al."Soft Magnetic Skin's Deformation Analysis for Tactile Perception".IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS 70.12(2023):12883-12893.

入库方式： OAI收割

来源：自动化研究所

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