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Chinese Academy of Sciences Institutional Repositories Grid
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浏览/检索结果: 共6条,第1-6条 帮助

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Transverse MNP Signal-Based Isotropic Imaging for Magnetic Particle Imaging 期刊论文  OAI收割
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2024, 卷号: 73, 页码: 13
作者:  
  |  收藏  |  浏览/下载:34/0  |  提交时间:2024/03/26
Shear-wave velocity structures of the shallow crust beneath the Ordos and Sichuan Basins from multi-frequency direct P-wave amplitudes in receiver functions 期刊论文  OAI收割
SCIENCE CHINA-EARTH SCIENCES, 2022, 页码: 14
作者:  
Tang, Chenxiao;  Chen, Ling;  Wang, Xu
  |  收藏  |  浏览/下载:26/0  |  提交时间:2022/07/12
一种恒流源电路 专利  OAI收割
专利号: CN206931835U, 申请日期: 2018-01-26, 公开日期: 2018-01-26
作者:  
徐琛潇
  |  收藏  |  浏览/下载:21/0  |  提交时间:2019/12/24
一种恒流源电路 专利  OAI收割
专利号: CN107293937A, 申请日期: 2017-10-24, 公开日期: 2017-10-24
作者:  
徐琛潇;  李锦辉;  赵一柱;  陈祥雪;  缪秋滚
  |  收藏  |  浏览/下载:24/0  |  提交时间:2020/01/18
Development of deep reactive ion etching and Cu electroplating of tapered via for 3D integration 期刊论文  OAI收割
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, 期号: 0, 页码: 65-67
Chen, Xiao; Tang, Jiajie; Xu, Gaowei; Luo, L
收藏  |  浏览/下载:21/0  |  提交时间:2012/08/23
Development of deep reactive ion etching and Cu electroplating of tapered via for 3D integration 期刊论文  OAI收割
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, 页码: 65-67
Chen, Xiao; Tang, Jiajie; Xu, Gaowei; Luo, Le
收藏  |  浏览/下载:25/0  |  提交时间:2012/08/23