机构

• 植物研究所 [13]
• 西安光学精密机械研究... [8]
• 西北高原生物研究所 [4]
• 武汉物理与数学研究所 [2]
• 中国科学院大学 [1]

采集方式

• OAI收割 [27]
• iSwitch采集 [1]

内容类型

• 期刊论文 [24]
• 会议论文 [4]

发表日期

• 2021 [2]
• 2020 [2]
• 2018 [1]
• 2017 [1]
• 2016 [4]
• 2015 [4]
• 更多

学科主题

• Plant Scie... [5]
• semiconduc... [3]
• computer a... [2]
• lasers, ge... [2]
• light/opti... [2]
• numerical ... [2]
• 更多

筛选

浏览/检索结果: 共28条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Biomass partitioning pattern of Rheum tanguticum on the Qinghai-Tibet Plateau was affected by water-related factors 期刊论文  OAI收割 PLANT ECOLOGY, 2021, 卷号: 222, 期号: 4 作者:  Xiong, Feng;  Nie, Xiuqing;  Yang, Lucun;  Wang, Lingling;  Li, Jingjing   |  收藏  |  浏览/下载：24/0  |  提交时间：2021/11/18 Rheum tanguticum  Qinghai–  Tibet Plateau  Biomass partitioning  Environmental factors  Scaling exponent   Non-target metabolomics revealed the differences between Rh. tanguticum plants growing under canopy and open habitats 期刊论文  OAI收割 BMC PLANT BIOLOGY, 2021, 卷号: 21, 期号: 1 作者:  Xiong, Feng;  Nie, Xiuqing;  Yang, Lucun;  Wang, Lingling;  Li, Jingjing   |  收藏  |  浏览/下载：24/0  |  提交时间：2021/11/18 Rheum tanguticum  Habitats  Non-target metabolism  Morphology  Ecotypes   Nitrogen Fertilizer Levels Affect the Growth and Quality Parameters of Astragalus mongolica 期刊论文  OAI收割 MOLECULES, 2020, 卷号: 25, 期号: 2 作者:  Wang, Lingling;  Yang, Lucun;  Xiong, Feng;  Nie, Xiuqing;  Li, Changbin   |  收藏  |  浏览/下载：23/0  |  提交时间：2020/11/25 nitrogen fertilizer  Astragaloside IV  mullein isoflavone glucoside  harvest time  yield  Qinghai-Tibet Plateau   Examining differences in phylogenetic composition enhances understanding of the phylogenetic structure of the shrub community in the northeastern Qinghai-Tibetan Plateau 期刊论文  OAI收割 ECOLOGY AND EVOLUTION, 2020, 卷号: 10, 期号: 13 作者:  Xiao, Yuanming;  Yang, Lucun;  Nie, Xiuqing;  Li, Changbin;  Xiong, Feng   |  收藏  |  浏览/下载：24/0  |  提交时间：2020/11/25 climatic oscillations  phylogenetic community composition  phylogenetic community structure  Qinghai-Tibetan Plateau  shrub  species dispersal   Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829 作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai   |  收藏  |  浏览/下载：89/0  |  提交时间：2018/05/31 Component Architectures  Semiconductor Device Packaging   Thermal characteristics of kW-level conduction-cooled semiconductor laser array 期刊论文  OAI收割 Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering, 2017, 卷号: 46, 期号: 10 作者:     |  收藏  |  浏览/下载：72/0  |  提交时间：2017/12/30 Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna 收藏  |  浏览/下载：91/0  |  提交时间：2016/11/22 Chip scale packages  Defects  Degradation  Electronics packaging  High power lasers  Laser beam welding  Power semiconductor diodes  Reliability  Reliability analysis  Semiconductor diodes   A compact QCW conduction-cooled high power semiconductor laser array 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang 收藏  |  浏览/下载：40/0  |  提交时间：2016/11/22 Chip scale packages  Electronics packaging  Finite element method  High power lasers  High temperature applications  Temperature   Thermal behavior of microchannel cooled high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei 收藏  |  浏览/下载：40/0  |  提交时间：2016/11/22 Computational fluid dynamics  Copper  Crosstalk  Diodes  Electronics packaging  Finite element method  Flow of water  Heat resistance  Heat sinks  Hydraulics  Laser beam welding  Microchannels  Numerical methods  Optical properties  Power semiconductor diodes  Reliability  Thermodynamic properties   Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling 收藏  |  浏览/下载：53/0  |  提交时间：2016/11/22 Computer simulation  Electronics packaging  High power lasers  Numerical models  Occupational risks  Optical properties  Packaging  Power semiconductor diodes  Shear stress  Thermal stress