机构

• 西安光学精密机械研究... [7]
• 成都山地灾害与环境研... [2]
• 半导体研究所 [2]
• 地理科学与资源研究所 [1]
• 古脊椎动物与古人类研... [1]

采集方式

• OAI收割 [12]
• iSwitch采集 [1]

内容类型

• 期刊论文 [8]
• 会议论文 [5]

发表日期

• 2024 [2]
• 2023 [2]
• 2018 [1]
• 2016 [2]
• 2012 [1]
• 2011 [2]
• 更多

学科主题

• computer a... [2]
• light/opti... [2]
• semiconduc... [2]
• Engineerin... [1]
• copper [1]
• heat excha... [1]
• 更多

筛选

浏览/检索结果: 共13条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Mechanism of enhanced mobility of glacial debris flows induced by ice and rock avalanches in southeast Tibet, China: Insights from impact loading tests 期刊论文  OAI收割 EARTH SURFACE PROCESSES AND LANDFORMS, 2024, 卷号: N/A, 页码: 16 作者:  Jiang, Yao;  Lu, Xingsheng;  Wang, Jiao;  Zhang, Guotao;  Wang, Gonghui   |  收藏  |  浏览/下载：5/0  |  提交时间：2025/02/06 enhanced mobility  liquefaction behaviour  moraine, ice and rock avalanches  shear strength weakening   Mechanism of enhanced mobility of glacial debris flows induced by ice and rock avalanches in southeast Tibet, China: Insights from impact loading tests 期刊论文  OAI收割 EARTH SURFACE PROCESSES AND LANDFORMS, 2024, 页码: 16 作者:  Jiang, Yao;  Lu, Xingsheng;  Wang, Jiao;  Zhang, Guotao;  Wang, Gonghui   |  收藏  |  浏览/下载：4/0  |  提交时间：2024/12/23 enhanced mobility  liquefaction behaviour  moraine, ice and rock avalanches  shear strength weakening   Dental microwear texture analysis reveals a likely dietary shift within Late Cretaceous ornithopod dinosaurs 期刊论文  OAI收割 PALAEONTOLOGY, 2023, 卷号: 66, 期号: 6, 页码: 17 作者:  Kubo, Tai;  Kubo, Mugino O.;  Sakamoto, Manabu;  Winkler, Daniela E.;  Shibata, Masateru   |  收藏  |  浏览/下载：14/0  |  提交时间：2024/03/27 dental microwear texture analysis  ornithopod dinosaurs  angiosperm  Cretaceous  dietary reconstruction   Progressive deformation and failure mechanism of loess fill slopes induce by rainfall: insights from flume model tests 期刊论文  OAI收割 BULLETIN OF ENGINEERING GEOLOGY AND THE ENVIRONMENT, 2023, 卷号: 82, 期号: 10, 页码: 18 作者:  Lu, Xingsheng;  Jiang, Yao;  Wang, Nianqin;  Shen, Huihui   |  收藏  |  浏览/下载：28/0  |  提交时间：2023/11/17 Loess fill slope  Flume model experiment  Failure mode  Failure mechanism   Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829 作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai   |  收藏  |  浏览/下载：89/0  |  提交时间：2018/05/31 Component Architectures  Semiconductor Device Packaging   Thermal behavior of microchannel cooled high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei 收藏  |  浏览/下载：40/0  |  提交时间：2016/11/22 Computational fluid dynamics  Copper  Crosstalk  Diodes  Electronics packaging  Finite element method  Flow of water  Heat resistance  Heat sinks  Hydraulics  Laser beam welding  Microchannels  Numerical methods  Optical properties  Power semiconductor diodes  Reliability  Thermodynamic properties   Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling 收藏  |  浏览/下载：53/0  |  提交时间：2016/11/22 Computer simulation  Electronics packaging  High power lasers  Numerical models  Occupational risks  Optical properties  Packaging  Power semiconductor diodes  Shear stress  Thermal stress   Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste 期刊论文  OAI收割 journal of electronic packaging, 2012, 卷号: 134, 期号: 4, 页码: 041003 作者:  Yan, Yi;  Chen, Xu;  Liu, Xingsheng;  Mei, Yunhui;  Lu, Guo-Quan 收藏  |  浏览/下载：23/0  |  提交时间：2013/10/11 nanosilver paste  laser diodes  die bonding   Packaging of High Power Density Double Quantum Well Semiconductor Laser Array using Double-side Cooling Technology 会议论文  OAI收割 proceedings of 11th on electronic packaging technology& high density packaging (icept-hdp), 上海, 2011-8-8 Wang Jingwei(王警卫); Zhang Pu （张普）; Xiong Lingling(熊玲玲); Li Xiaoning （李小宁）; Peng Chenhui（彭晨晖）; Yuan Zhenbang （袁振邦）; Guo Lu （郭璐）; Liu Xingsheng （刘兴胜） 收藏  |  浏览/下载：23/0  |  提交时间：2011/12/27 Die Bonding of Single Emitter Semiconductor Laser with Nano-Scale Silver Paste 会议论文  OAI收割 proceedings of 11th on electronic packaging technology& high density packaging (icept-hdp), 上海, 2011-8-8 Yan Yi （鄢艺）; Chen Xu（陈旭）; Liu XingSheng （刘兴胜）; Lu GuoQuan（陆国权） 收藏  |  浏览/下载：29/0  |  提交时间：2011/12/27