机构

• 深圳先进技术研究院 [7]
• 过程工程研究所 [1]

采集方式

• OAI收割 [8]

内容类型

• 会议论文 [5]
• 期刊论文 [3]

发表日期

• 2023 [1]
• 2017 [2]
• 2016 [3]
• 2015 [1]
• 2014 [1]

学科主题

筛选

浏览/检索结果: 共8条，第1-8条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Rational construction of multiple hollow silicalite-1 zeolite with enhanced quasi acidity for robust vapor-phase Beckmann rearrangement 期刊论文  OAI收割 NANO RESEARCH, 2023, 页码: 9 作者:  Zhang, Peng;  Yi, Xianfeng;  Xia, Changjiu;  Peng, Xinxin;  Zhang, Shuai   |  收藏  |  浏览/下载：0/0  |  提交时间：2023/05/19 hollow silicalite-1  H-bonded silanols  quasi acidity  vapor-phase Beckmann rearrangement   A highly sensitive flexible pressure sensor based on multi-scale structure and silver nanowires 会议论文  OAI收割 Harbin, China 作者:  Longquan Ma;  Xingtian Shuai;  Pengli Zhu;  Rong Sun   |  收藏  |  浏览/下载：22/0  |  提交时间：2018/02/02 Highly Sensitive Flexible Pressure Sensor Based on Silver Nanowires-Embedded Polydimethylsiloxane Electrode with Microarray Structure. 期刊论文  OAI收割 ACS APPLIED MATERIALS & INTERFACES, 2017 作者:  Shuai, Xingtian ;   Zhu, Pengli ;   Zeng, Wenjin ;   Hu, Yougen ;   Liang, Xianwen    |  收藏  |  浏览/下载：46/0  |  提交时间：2018/02/02 A highly sensitive flexible capacitive pressure sensor based on micro-array dielectric layer and silver nanowires 会议论文  OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Xingtian Shuai;  Pengli Zhu;  Yougen Hu;  Qian Guo;  Haibo Su 收藏  |  浏览/下载：20/0  |  提交时间：2017/01/15 Low cost and highly conductive elastic composites for flexible and printable electronics 期刊论文  OAI收割 JOURNAL OF MATERIALS CHEMISTRY C, 2016 作者:  Hu, Yougen;  Zhao, Tao 收藏  |  浏览/下载：27/0  |  提交时间：2017/01/13 Reduced graphene oxide as ink materials for the high performance flexible and wearable energy storage devices 会议论文  OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Haibo Su;  Pengli Zhu;  Fengrui Zhou;  Leicong Zhang;  Yankang Han 收藏  |  浏览/下载：30/0  |  提交时间：2017/01/15 Preparation of Reversible Thermosets and Their Application in Temporary Adhesive for Thin Wafer Handling 会议论文  OAI收割 Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, San Diego, California, USA 作者:  Libo. Deng;  Haoming. Fang;  Xingtian. Shuai;  Guoping. Zhang;  C. P. Wong and Rong 收藏  |  浏览/下载：18/0  |  提交时间：2016/01/27 A novel temporary adhesive for thin wafer handling 会议论文  OAI收割 Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国 作者:  Shuai, Xingtian;  Sun, Rong;  Zhang, Guoping;  Deng, Libo 收藏  |  浏览/下载：18/0  |  提交时间：2015/09/01