中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
首页
机构
成果
学者
登录
注册
登陆
×
验证码:
换一张
忘记密码?
记住我
×
校外用户登录
CAS IR Grid
机构
深圳先进技术研究院 [7]
过程工程研究所 [1]
采集方式
OAI收割 [8]
内容类型
会议论文 [5]
期刊论文 [3]
发表日期
2023 [1]
2017 [2]
2016 [3]
2015 [1]
2014 [1]
学科主题
筛选
浏览/检索结果:
共8条,第1-8条
帮助
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
题名升序
题名降序
提交时间升序
提交时间降序
作者升序
作者降序
发表日期升序
发表日期降序
Rational construction of multiple hollow silicalite-1 zeolite with enhanced quasi acidity for robust vapor-phase Beckmann rearrangement
期刊论文
OAI收割
NANO RESEARCH, 2023, 页码: 9
作者:
Zhang, Peng
;
Yi, Xianfeng
;
Xia, Changjiu
;
Peng, Xinxin
;
Zhang, Shuai
  |  
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2023/05/19
hollow silicalite-1
H-bonded silanols
quasi acidity
vapor-phase Beckmann rearrangement
A highly sensitive flexible pressure sensor based on multi-scale structure and silver nanowires
会议论文
OAI收割
Harbin, China
作者:
Longquan Ma
;
Xingtian Shuai
;
Pengli Zhu
;
Rong Sun
  |  
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2018/02/02
Highly Sensitive Flexible Pressure Sensor Based on Silver Nanowires-Embedded Polydimethylsiloxane Electrode with Microarray Structure.
期刊论文
OAI收割
ACS APPLIED MATERIALS & INTERFACES, 2017
作者:
Shuai, Xingtian
;
Zhu, Pengli
;
Zeng, Wenjin
;
Hu, Yougen
;
Liang, Xianwen
  |  
收藏
  |  
浏览/下载:53/0
  |  
提交时间:2018/02/02
A highly sensitive flexible capacitive pressure sensor based on micro-array dielectric layer and silver nanowires
会议论文
OAI收割
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:
Xingtian Shuai
;
Pengli Zhu
;
Yougen Hu
;
Qian Guo
;
Haibo Su
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2017/01/15
Low cost and highly conductive elastic composites for flexible and printable electronics
期刊论文
OAI收割
JOURNAL OF MATERIALS CHEMISTRY C, 2016
作者:
Hu, Yougen
;
Zhao, Tao
;
Zhu, Pengli
;
Zhu, Yu
;
Shuai, Xingtian
收藏
  |  
浏览/下载:35/0
  |  
提交时间:2017/01/13
Reduced graphene oxide as ink materials for the high performance flexible and wearable energy storage devices
会议论文
OAI收割
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:
Haibo Su
;
Pengli Zhu
;
Fengrui Zhou
;
Leicong Zhang
;
Yankang Han
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2017/01/15
Preparation of Reversible Thermosets and Their Application in Temporary Adhesive for Thin Wafer Handling
会议论文
OAI收割
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, San Diego, California, USA
作者:
Libo. Deng
;
Haoming. Fang
;
Xingtian. Shuai
;
Guoping. Zhang
;
C. P. Wong and Rong
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2016/01/27
A novel temporary adhesive for thin wafer handling
会议论文
OAI收割
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者:
Shuai, Xingtian
;
Sun, Rong
;
Zhang, Guoping
;
Deng, Libo
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2015/09/01