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力学研究所 [5]
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期刊论文 [5]
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Chip formation dependence of machining velocities in nano-scale by molecular dynamics simulations
期刊论文
OAI收割
SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2014, 卷号: 57, 期号: 12, 页码: 2426-2433
作者:
Su H
;
Tang QH(汤奇恒)
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浏览/下载:50/0
  |  
提交时间:2015/01/23
molecular dynamics
chip formation
machining velocities
phase transition
Cutting AISI 1045 steel at very high speeds
期刊论文
OAI收割
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2012, 卷号: 56, 页码: 1-9
作者:
Ye GG(叶贵根)
;
Xue SF
;
Ma W(马维)
;
Jiang MQ(蒋敏强)
;
Ling Z(凌中)
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  |  
浏览/下载:36/0
  |  
提交时间:2013/01/18
High speed machining
AISI 1045 steel
Chip formation
Surface integrity
Thermoplastic shear
Chip Formation
Temperature-Fields
Flow-Stress
Shear
Instability
Behavior
Simulation
Forces
Instability criterion of materials in combined stress states and its application to orthogonal cutting process
期刊论文
OAI收割
INTERNATIONAL JOURNAL OF PLASTICITY, 2012, 卷号: 30-31, 页码: 18-40
作者:
Ma W(马维)
;
Li XW(李相旺)
;
Dai LH(戴兰宏)
;
Ling Z(凌中)
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  |  
浏览/下载:15/0
  |  
提交时间:2013/01/18
Instability criterion
Plastic collapse
Cutting and forming
Asymptotic analysis
Thermomechanical processes
Shear-Band Formation
Chip Formation
Strain Localization
Simulation
Temperatures
Plasticity
Prediction
Rates
Model
Flow
Slip-line field modeling of orthogonal machining pressure sensitive materials
期刊论文
OAI收割
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2012, 卷号: 58, 期号: 9-12, 页码: 907-914
作者:
Ye GG(叶贵根)
;
Xue SF(薛世峰)
;
Tong XH(仝兴华)
;
Dai LH(戴兰宏)
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  |  
浏览/下载:52/0
  |  
提交时间:2013/01/18
Orthogonal cutting
Slip-line field
Pressure sensitivity
Shear plane
Bulk Metallic-Glass
Chip Formation
Tool Wear
Force
Mechanics
Influence of cutting conditions on the cutting performance of TiAl6V4
会议论文
OAI收割
International Conference on Materials and Products Manufacturing Technology (ICMPMT 2011), Chengdu, PEOPLES R CHINA, OCT 28-30, 2011
作者:
Ye GG(叶贵根)
;
Xue SF
;
Tong XH
;
Dai LH(戴兰宏)
收藏
  |  
浏览/下载:93/0
  |  
提交时间:2013/02/26
Chip morphology
Size effect
Cutting temperature
TiAl6V4
CHIP FORMATION
ALLOY
SIMULATION
TI-6AL-4V
Mechanical properties of arrayed Pb-free tin bump and its interfacial reaction with Ni-PUBM during reflow process
期刊论文
OAI收割
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, 页码: 51-54
Zhu, DP
;
Le, L
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浏览/下载:16/0
  |  
提交时间:2012/03/24
INTERMETALLIC COMPOUND FORMATION
FLIP-CHIP TECHNOLOGY
SN-3.5AG SOLDER
AG SOLDER
METALLIZATION
RELIABILITY