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Chinese Academy of Sciences Institutional Repositories Grid
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Simulations of deformation and damage processes of SiCp/Al composites during tension 期刊论文  OAI收割
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 4, 页码: 627-634
作者:  
Zhang, JF;  Zhang, XX;  Wang, QZ;  Xiao, BL;  Ma, ZY
  |  收藏  |  浏览/下载:29/0  |  提交时间:2018/06/05
A trans-scale model for size effects and intergranular fracture in nanocrystalline and ultra-fine polycrystalline metals 期刊论文  OAI收割
COMPUTATIONAL MATERIALS SCIENCE, 2012, 卷号: 57, 页码: 2-7
作者:  
Wu B(吴波);  Liang LH(梁立红);  Ma HS(马寒松);  Wei YG(魏悦广);  Wei, YG
收藏  |  浏览/下载:26/0  |  提交时间:2013/01/18
An enhanced FEM model for particle size dependent flow strengthening and interface damage in particle reinforced metal matrix composites 期刊论文  OAI收割
Composites Science and Technology, 2011, 卷号: 71, 期号: 1, 页码: 39-45
J. C. Shao; B. L. Xiao; Q. Z. Wang; Z. Y. Ma; K. Yang
收藏  |  浏览/下载:19/0  |  提交时间:2012/04/13
Simulation of effects of particle size and volume fraction on Al alloy strength, elongation, and toughness by using strain gradient plasticity concept 期刊论文  OAI收割
Materials & Design, 2011, 卷号: 32, 期号: 1, 页码: 353-360
L. Zhou; S. X. Li; S. T. Huang
收藏  |  浏览/下载:112/0  |  提交时间:2012/04/13
How do children coordinate information about mental states with social norms? 期刊论文  OAI收割
COGNITIVE DEVELOPMENT, 2011, 卷号: 26, 期号: 1, 页码: 72-81
作者:  
Wang, Fei;  Zhu, Liqi;  Shi, Kan
收藏  |  浏览/下载:22/0  |  提交时间:2015/08/24
A New Hybrid DFT Approach to Electronic Excitation and First Hyperpolarizabilities of Transition Metal Complexes 期刊论文  OAI收割
Journal of Computational Chemistry, 2009, 卷号: 30, 期号: 13, 页码: 2056-2063
J. Lin, K. C. Wu and M. X. Zhang
收藏  |  浏览/下载:22/0  |  提交时间:2012/11/06
Simulations of Mechanical Behavior of Polycrystalline Copper with Nano-Twins 期刊论文  OAI收割
Acta Mechanica Solida Sinica, 2008, 页码: 189-197
作者:  
Wu B(吴波)
收藏  |  浏览/下载:598/43  |  提交时间:2009/08/03
Small scale, grain size and substrate effects in nano-indentation experiment of film-substrate systems 期刊论文  OAI收割
International Journal of Solids and Structures, 2007, 卷号: 44, 期号: 13, 页码: 4492-4504
作者:  
Chen SH(陈少华);  Liu L(刘磊);  Wang ZQ(王自强)
收藏  |  浏览/下载:967/46  |  提交时间:2009/08/03
An improved adaptive neural network method for control system (EI CONFERENCE) 会议论文  OAI收割
2006 International Conference on Machine Learning and Cybernetics, August 13, 2006 - August 16, 2006, Dalian, China
Wang L.-M.; Xie M.-J.; Wu D.-Y.
收藏  |  浏览/下载:15/0  |  提交时间:2013/03/25
Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE) 会议论文  OAI收割
ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China
作者:  
Zhang G.;  Zhang G.;  Zhang G.;  Zhang J.;  Zhang J.
收藏  |  浏览/下载:22/0  |  提交时间:2013/03/25
The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting  when the cutting velocity equals 100mm/min  while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth  double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow  rapid cutting speed  the cutting quality meets the expecting demand.  fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power  using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence  a /4 waveplate to compensate heat -induced birefraction  utilize the Nd:YAG self- aperture effect  more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens  double axis linear step motor positioning system  suitable beam expander multiplying factor  appropriate diameter of exit beam aperture  proper repetition rate  when the cutting velocity equals 400mm/min  0.75mm thick silicon wafer can be penetrated