中国科学院机构知识库网格系统: 检索

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	Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文 OAI收割 MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8 作者: Zhu, Qing-Sheng; Ding, Zi-Feng; Wei, Xiang-Fu; Guo, Jing-dong; Wang, Xiao-Jing \| 收藏 \| 浏览/下载：7/0 \| 提交时间：2024/01/07 Copper pillar bump Cu electroplating Leveler Interfacial voids Chip packaging
	Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor 期刊论文 OAI收割 JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11 作者: Wei, Xiang-Fu; Zhu, Qing-Sheng; Guo, Jing-Dong; Shang, Jian-Ku \| 收藏 \| 浏览/下载：43/0 \| 提交时间：2021/11/22 Copper electroplating Throwing power (TP) Flexible printed circuit (FPC) Suppressor
	DTL construction status of China Spallation Neutron Source 期刊论文 OAI收割 ATOMIC ENERGY SCIENCE AND TECHNOLOGY, 2015, 卷号: 49, 页码: 556-559 作者: Liu; Hua-Chang; Peng; Jun; Gong 收藏 \| 浏览/下载：43/0 \| 提交时间：2016/04/18 Construction status Copper electroplating Drift-tube linac DTL Fabrication process High electrical conductivity High intensity beam Spallation neutron sources
	强化H2O2氧化水中Cu(CN)32-的机制与方法学位论文 OAI收割博士, 北京: 中国科学院研究生院, 2014 作者: 陈发源收藏 \| 浏览/下载：205/0 \| 提交时间：2016/08/16 电镀废水铜氰络合物电化学 H2O2氧化电芬顿，Electroplating wastewater Copper cyanide complex Hydrogen peroxide oxidation Electrochemical Fenton
	Encapsulation of copper-based phase change materials for high temperature thermal energy storage 期刊论文 OAI收割 SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2014, 卷号: 128, 期号: SEP., 页码: 131-137 作者: Zhang, Guocai; Li, Jianqiang; Chen, Yunfa; Xiang, Heng; Ma, Bingqian 收藏 \| 浏览/下载：28/0 \| 提交时间：2014/09/30 Phase change materials Encapsulation Electroplating Copper Chromium-nickel layer Charge-discharge cycle
	Study of the zinc electroplating process using electrochemical noise technique 期刊论文 OAI收割 Journal of Electroanalytical Chemistry, 2005, 卷号: 578, 期号: 2, 页码: 357-367 Z. Zhang; W. H. Leng; Q. Y. Cai; F. H. Cao; J. Q. Zhang 收藏 \| 浏览/下载：18/0 \| 提交时间：2012/04/14 zinc electroplating electrochemical noise electrodeposit structure glassy-carbon layered nanostructures copper/cuprous oxide wavelets transform electrodeposition nucleation electrocrystallization crystallization behavior silver