中国科学院机构知识库网格系统: 检索

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	Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current 期刊论文 OAI收割 Journal of Applied Physics, 2014, 卷号: 116, 期号: 10 X. M. Luo; B. Zhang; G. P. Zhang 收藏 \| 浏览/下载：24/0 \| 提交时间：2015/01/14 molecular-dynamics simulation fine-grained materials thermal fatigue damage deformation-behavior cu interconnects current stress electromigration films technology diffusion
	Alternating-current induced thermal fatigue of gold interconnects with nanometer-scale thickness and width 期刊论文 OAI收割 Review of Scientific Instruments, 2011, 卷号: 82, 期号: 10, 页码: 103903 作者: Sun LJ; Ling X; Li XD 收藏 \| 浏览/下载：26/0 \| 提交时间：2012/04/01 Cu Interconnects Damage Electromigration Metallization Frequency Mechanism Failure Lines Films
	Effect of electrodeposition parameters on the hydrogen permeation during Cu-Sn alloy electrodeposition 期刊论文 OAI收割 Electrochimica Acta, 2010, 卷号: 55, 期号: 7, 页码: 2238-2245 G. Z. Meng; F. L. Sun; S. J. Wang; Y. W. Shao; T. Zhang; F. H. Wang 收藏 \| 浏览/下载：29/0 \| 提交时间：2012/04/13 Cu-Sn alloy coating Hydrogen blister Hydrogen permeation Hydrogen diffusivity Pulse current electrodeposition pyrophosphate-based electrolytes different temperatures ph-microscopy carbon-steel thin-films iron electromigration deposition metals interconnects
	An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy 期刊论文 OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 129-136 M. Sang; K. Du; H. Q. Ye 收藏 \| 浏览/下载：11/0 \| 提交时间：2012/04/13 Intermetallics Crystal structure Cu(3)Sn Transmission electron microscopy pb-free solders interfacial reactions high-resolution tin-lead intermetallics copper contrast nanoindentation interconnects kinetics