中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
金属研究所 [3]
力学研究所 [1]
采集方式
OAI收割 [4]
内容类型
期刊论文 [4]
发表日期
2014 [1]
2011 [1]
2010 [1]
2009 [1]
学科主题
Instrument... [1]
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Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current
期刊论文
OAI收割
Journal of Applied Physics, 2014, 卷号: 116, 期号: 10
X. M. Luo
;
B. Zhang
;
G. P. Zhang
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2015/01/14
molecular-dynamics simulation
fine-grained materials
thermal fatigue
damage
deformation-behavior
cu interconnects
current stress
electromigration
films
technology
diffusion
Alternating-current induced thermal fatigue of gold interconnects with nanometer-scale thickness and width
期刊论文
OAI收割
Review of Scientific Instruments, 2011, 卷号: 82, 期号: 10, 页码: 103903
作者:
Sun LJ
;
Ling X
;
Li XD
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2012/04/01
Cu Interconnects
Damage
Electromigration
Metallization
Frequency
Mechanism
Failure
Lines
Films
Effect of electrodeposition parameters on the hydrogen permeation during Cu-Sn alloy electrodeposition
期刊论文
OAI收割
Electrochimica Acta, 2010, 卷号: 55, 期号: 7, 页码: 2238-2245
G. Z. Meng
;
F. L. Sun
;
S. J. Wang
;
Y. W. Shao
;
T. Zhang
;
F. H. Wang
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2012/04/13
Cu-Sn alloy coating
Hydrogen blister
Hydrogen permeation
Hydrogen
diffusivity
Pulse current electrodeposition
pyrophosphate-based electrolytes
different temperatures
ph-microscopy
carbon-steel
thin-films
iron
electromigration
deposition
metals
interconnects
An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy
期刊论文
OAI收割
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 129-136
M. Sang
;
K. Du
;
H. Q. Ye
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2012/04/13
Intermetallics
Crystal structure
Cu(3)Sn
Transmission electron
microscopy
pb-free solders
interfacial reactions
high-resolution
tin-lead
intermetallics
copper
contrast
nanoindentation
interconnects
kinetics