中国科学院机构知识库网格系统: 检索

浏览/检索结果: 共5条，第1-5条

帮助

条数/页：排序方式：
	Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文 OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者: Zhang, Qingke; Hu, Fangqin; Song, Zhenlun \| 收藏 \| 浏览/下载：60/0 \| 提交时间：2020/12/16 LEAD-FREE SOLDERS INTERMETALLIC COMPOUNDS LIQUID SN KINETICS GROWTH CU6SN5 METALLIZATION
	Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文 OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271 Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku 收藏 \| 浏览/下载：35/0 \| 提交时间：2017/08/17 Electromigration Single crystal tin Cu6Sn5 Intermetallic compounds Orientation Diffusion
	Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文 OAI收割 MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: - Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan 收藏 \| 浏览/下载：24/0 \| 提交时间：2017/08/17 Cu6Sn5 whiskers Ag3Sn fibers mechanical property screw dislocation
	Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress 期刊论文 OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 3290-3298 Chen, Jian-Qiang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku 收藏 \| 浏览/下载：25/0 \| 提交时间：2017/08/17 Cu6Sn5 Tin Orientation Solid state reaction Electromigration
	Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文 OAI收割 Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596 L. M.; Zhang Yang, Z. F. 收藏 \| 浏览/下载：27/0 \| 提交时间：2015/05/08 Intermetallic compounds (IMC) solder joint cooling rate solidification adsorption ag-cu solder cu6sn5 grains in-situ sn alloy nanoparticles ag3sn microstructure technology particles