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浏览/检索结果: 共69条，第1-10条 帮助

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Effects of stannum (Sn) addition on corrosion behavior and biocompatibility in vitro of biodegradable Zn-Sn alloys 期刊论文  OAI收割
MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION, 2021
作者:  Guo, Pushan;  Bagheri, Robabeh;  Yang, Lijing;  Song, Zhenlun;  Liu, Yaxuan
  |  收藏  |  浏览/下载：16/0  |  提交时间：2021/12/01
Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying 期刊论文  OAI收割
MATERIALS TODAY COMMUNICATIONS, 2021, 卷号: 29
作者:  Zhu, Tangkui;  Zhang, Qingke;  Bai, Hailong;  Zhao, Lingyan;  Yan, Jikang
  |  收藏  |  浏览/下载：11/0  |  提交时间：2021/12/01
LEAD-FREE SOLDER  NI  BEHAVIOR  CU  SB  AG  MICROSTRUCTURE  (CU  BI  CO  
Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文  OAI收割
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390
作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun
  |  收藏  |  浏览/下载：47/0  |  提交时间：2020/12/16
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文  OAI收割
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
  |  收藏  |  浏览/下载：103/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文  OAI收割
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
  |  收藏  |  浏览/下载：2/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文  OAI收割
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
  |  收藏  |  浏览/下载：4/0  |  提交时间：2021/02/02
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文  OAI收割
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H
  |  收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文  OAI收割
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.;  Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
  |  收藏  |  浏览/下载：22/0  |  提交时间：2018/01/10
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文  OAI收割
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
作者:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM
收藏  |  浏览/下载：17/0  |  提交时间：2017/10/27
Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文  OAI收割
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570
作者:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China.
收藏  |  浏览/下载：13/0  |  提交时间：2017/10/27