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	Design and Control of an Underactuated Finger Exoskeleton for Assisting Activities of Daily Living 期刊论文 OAI收割 IEEE-ASME TRANSACTIONS ON MECHATRONICS, 2021, 页码: 11 作者: Li, Houcheng; Cheng, Long; Sun, Ning; Cao, Ran \| 收藏 \| 浏览/下载：35/0 \| 提交时间：2022/01/27 Exoskeletons Grasping Electronics packaging Kinematics Senior citizens Robots Shape Admittance control assistance finger exoskeleton preshaping shape-adaptive grasping underactuation
	Design and Validation of a Self-Aligning Index Finger Exoskeleton for Post-Stroke Rehabilitation 期刊论文 OAI收割 IEEE TRANSACTIONS ON NEURAL SYSTEMS AND REHABILITATION ENGINEERING, 2021, 卷号: 29, 页码: 1513-1523 作者: Sun, Ning; Li, Guotao; Cheng, Long \| 收藏 \| 浏览/下载：23/0 \| 提交时间：2021/11/02 Exoskeletons Indexes Kinematics Training Force Electronics packaging Task analysis Finger exoskeleton self-aligning mechanism kinematic compatibility kineto-statics
	A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules 会议论文 OAI收割 Hong Kong, China, August 12, 2019 - August 15, 2019 作者: Tian, Jun; Wang, Congsi; Liu, Shaoyi; Zhu, Cheng; Zhou, Cheng \| 收藏 \| 浏览/下载：40/0 \| 提交时间：2021/07/06 Microwave circuits Belts Electronics packaging Flexible electronics Gold Integrated circuit interconnects Microwaves Timing circuits
	Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Nie, Zhiqiang; Wu, Di; Lu, Yao; Wu, Dhai; Wang, Shuna 收藏 \| 浏览/下载：93/0 \| 提交时间：2016/11/22 Chip scale packages Defects Degradation Electronics packaging High power lasers Laser beam welding Power semiconductor diodes Reliability Reliability analysis Semiconductor diodes
	A compact QCW conduction-cooled high power semiconductor laser array 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Zhu, Qiwen; Zhang, Pu; Wang, Shuna; Wu, Dihai; Nie, Zhiqiang 收藏 \| 浏览/下载：41/0 \| 提交时间：2016/11/22 Chip scale packages Electronics packaging Finite element method High power lasers High temperature applications Temperature
	Thermal behavior of microchannel cooled high power diode laser arrays 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Wu, Dihai; Zhang, Pu; Nie, Zhiqiang; Xiong, Lingling; Song, Yunfei 收藏 \| 浏览/下载：41/0 \| 提交时间：2016/11/22 Computational fluid dynamics Copper Crosstalk Diodes Electronics packaging Finite element method Flow of water Heat resistance Heat sinks Hydraulics Laser beam welding Microchannels Numerical methods Optical properties Power semiconductor diodes Reliability Thermodynamic properties
	Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Lu, Yao 收藏 \| 浏览/下载：53/0 \| 提交时间：2016/11/22 Computer simulation Electronics packaging High power lasers Numerical models Occupational risks Optical properties Packaging Power semiconductor diodes Shear stress Thermal stress
	LED optical engine based on rectangular CPC for micro-projection display (EI CONFERENCE) 会议论文 OAI收割 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, November 19, 2008 - November 21, 2008, Chengdu, China 作者: Meng Z.; Meng Z. 收藏 \| 浏览/下载：18/0 \| 提交时间：2013/03/25 With applications in digital display consumer electronics medicine automotive lighting traffic signals and general illumination the light-emitting diode (LED) is the world's most efficient light source being mass produced today[1]. However high cost is the main factor restricting widespread application of LED lighting and the packaging is the most expensive aspect of LED products. Light emitting diodes (LED) are regarded as the most important light sources in solid-state lighting for their advantages in energy efficiency long life vivid colors high reliability environmental protection safety and multiple applications. However application of LEDs in projection display exist many questions such as low illuminance uniformity and low energy efficiency by reason of luminescence distribution and constructure specificity for LED the study on application of LED in the micro-projection display and projection display is reported[2-8]. Considering the question mensioned above the rectangular CPC(Compound Parabolic Concentrator) system with three-color LED is applied in the projection display. 2009 SPIE.