中国科学院机构知识库网格系统: 检索

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	Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文 OAI收割 MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8 作者: Zhu, Qing-Sheng; Ding, Zi-Feng; Wei, Xiang-Fu; Guo, Jing-dong; Wang, Xiao-Jing \| 收藏 \| 浏览/下载：6/0 \| 提交时间：2024/01/07 Copper pillar bump Cu electroplating Leveler Interfacial voids Chip packaging
	W-Cu composites with homogenous Cu-network structure prepared by spark plasma sintering using core-shell powders 期刊论文 OAI收割 INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2019, 卷号: 82, 页码: 310-316 作者: Deng, Nan; Zhou, Zhangjian; Li, Jianqiang; Wu, Yuchuan \| 收藏 \| 浏览/下载：57/0 \| 提交时间：2019/09/03 W-Cu composites Electroplating Cu-network structure Core-shell powder W-W contiguity
	Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition 期刊论文 OAI收割 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 758, 页码: 1-6 作者: Li, Sujie; Zhu, Qingsheng; Zheng, Boda; Yuan, Jie; Wang, Xiaojing \| 收藏 \| 浏览/下载：15/0 \| 提交时间：2021/02/02 Electroplating Cu Gelatin Equiaxed microstructure Twinning
	Sustainable electrochemical recovery of high-purity Cu powders from multi-metal acid solution by a centrifuge electrode 期刊论文 OAI收割 JOURNAL OF CLEANER PRODUCTION, 2018, 卷号: 204, 页码: 41-49 作者: Wang, Mingyong; Gong, Xuzhong; Wang, Zhi \| 收藏 \| 浏览/下载：40/0 \| 提交时间：2018/12/04 High-purity Cu Powder Centrifuge Electrode Electrochemical Recovery Multi-metal Solution Electroplating Sludge
	铜络合物的氧化破络合及电还原回收铜研究学位论文 OAI收割硕士, 北京: 中国科学院研究生院, 2016 作者: 曾华斌收藏 \| 浏览/下载：239/0 \| 提交时间：2017/07/05 光电催化，电镀废水，破络合，铜回收 Photoelectrocatalysis, Electroplating wastewater, Decomplexation,Cu recovrey