中国科学院机构知识库网格系统: 检索

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	Bulk eutectic Cu-Ag alloys with abundant twin boundaries 期刊论文 OAI收割 Scripta Materialia, 2012, 卷号: 66, 期号: 2, 页码: 65-68 Y. Z. Tian; Z. F. Zhang 收藏 \| 浏览/下载：25/0 \| 提交时间：2013/02/05 Eutectic Cu-Ag alloy Twin boundary Electron backscattering diffraction (EBSD) Strength Ductility strain-rate sensitivity mechanical-properties nanostructured materials plastic-deformation tensile properties maximum strength nanoscale twins al alloys ductility metals
	Microstructures, strengthening mechanisms and fracture behavior of Cu-Ag alloys processed by high-pressure torsion 期刊论文 OAI收割 Acta Materialia, 2012, 卷号: 60, 期号: 1, 页码: 269-281 Y. Z. Tian; J. J. Li; P. Zhang; S. D. Wu; Z. F. Zhang; M. Kawasaki; T. G. Langdon 收藏 \| 浏览/下载：36/0 \| 提交时间：2013/02/05 Eutectic Cu-Ag alloy High-pressure torsion Microstructure Hardness Fracture severe plastic-deformation bulk metallic-glass grain-refinement shear fracture composites evolution wires nucleation
	Microstructures and tensile deformation behavior of Cu-16 wt.% Ag binary alloy 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2009, 卷号: 508, 期号: 1-2, 页码: 209-213 Y. Z. Tian; Z. F. Zhang 收藏 \| 浏览/下载：20/0 \| 提交时间：2012/04/13 Cu-Ag alloy Microstructure Tensile deformation Precipitates Eutectic Slip bands in-situ composites cu-ag high-strength filamentary composites yield strength microcomposites conductivity evolution wires
	Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文 OAI收割 Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129 H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：25/0 \| 提交时间：2012/04/13 Sn-Ag-Zn lead-free solder gravity interfaces intermetallic compounds lead-free solders cu substrate bump metallization tensile properties phase-equilibria eutectic alloy ni behavior bi microstructure