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浏览/检索结果: 共100条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer 期刊论文  OAI收割 JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29 作者:  Zhang, Ping;  Zhang, Xian;  Ding, Xin;  Wang, Yanyan;  Xiao, Chao   |  收藏  |  浏览/下载：29/0  |  提交时间：2022/12/23 Segregated structure  Intermetallic compound  Thermal conductivity  Sliver interface layer   A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder 期刊论文  OAI收割 MATERIALS LETTERS, 2021, 卷号: 297, 页码: 4 作者:     |  收藏  |  浏览/下载：53/0  |  提交时间：2021/10/15 Lead-free solder  Thin films  Oxidation  Corrosion  X-ray photoelectron spectroscopy (XPS)   Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15 作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：13/0  |  提交时间：2021/03/15 Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262 作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.   |  收藏  |  浏览/下载：10/0  |  提交时间：2021/02/03 Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262 作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.   |  收藏  |  浏览/下载：15/0  |  提交时间：2021/01/11 Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying 期刊论文  OAI收割 MATERIALS TODAY COMMUNICATIONS, 2021, 卷号: 29 作者:  Zhu, Tangkui;  Zhang, Qingke;  Bai, Hailong;  Zhao, Lingyan;  Yan, Jikang   |  收藏  |  浏览/下载：10/0  |  提交时间：2021/12/01 LEAD-FREE SOLDER  NI  BEHAVIOR  CU  SB  AG  MICROSTRUCTURE  (CU  BI  CO   Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9 作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：6/0  |  提交时间：2021/02/02 Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point   Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9 作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02 Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point   Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun   |  收藏  |  浏览/下载：47/0  |  提交时间：2020/12/16 LEAD-FREE SOLDERS  INTERMETALLIC COMPOUNDS  LIQUID SN  KINETICS  GROWTH  CU6SN5  METALLIZATION   Reliability issues of lead-free solder joints in electronic devices 期刊论文  OAI收割 SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901 作者:  Jiang, Nan;  Zhang, Liang   |  收藏  |  浏览/下载：47/0  |  提交时间：2021/02/02 Lead-free solder  reliability  IMC  crack  failure