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浏览/检索结果: 共58条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Improving interfacial microstructure and mechanical properties of ODS-W/ Cu joints via anodization treatment and spark plasma sintering 期刊论文  OAI收割 JOURNAL OF NUCLEAR MATERIALS, 2024, 卷号: 601 作者:  Xu, Dang;  Fu, Kaichao;  Sang, Changcheng;  Chen, Ruizhi;  Chen, Pengqi   |  收藏  |  浏览/下载：5/0  |  提交时间：2024/11/20 ODS-W/Cu joints  Anodization treatment  SPS bonding technology  Interfacial microstructure  Mechanical properties   Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair 期刊论文  OAI收割 ENGINEERING FAILURE ANALYSIS, 2023, 卷号: 153, 页码: 14 作者:  Lin, Y.;  Li, J. Z.;  Pan, J.;  Zhang, C.;  Ni, D. R.   |  收藏  |  浏览/下载：16/0  |  提交时间：2024/01/08 Current-carrying wear  Cu/Al tribological pairs  Al deposit adhesion  Interfacial microstructure   A hot-compression bonding method for manufacturing large high-speed homogeneous steels 期刊论文  OAI收割 JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, 卷号: 17, 页码: 507-520 作者:  Liu, Weifeng;  Zhang, Jianyang;  Sun, Mingyue;  Xu, Bin;  Cao, Yanfei   |  收藏  |  浏览/下载：40/0  |  提交时间：2022/07/01 Hot-compression bonding  High-speed steel  Interfacial microstructure  Interfacial healing  Tensile strength   Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer 期刊论文  OAI收割 CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 4, 页码: 4484-4496 作者:  Cheng, Qiang;  Zheng, LiLi;  Li, XiChao;  Xu, Bin;  Sun, MingYue   |  收藏  |  浏览/下载：42/0  |  提交时间：2022/07/01 Solid diffusion bonding  Ti3SiC2 ceramic  SUS430  Interfacial microstructure  Growth kinetics   TEM study on the morphology and interface microstructure of C/C-SiC composites fabricated by liquid infiltration 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2021, 卷号: 175, 页码: 7 作者:  Zhang, K. X.;  Guo, X. S.;  Cheng, Y. X.;  Zhang, F. Q.;  He, L. L.   |  收藏  |  浏览/下载：25/0  |  提交时间：2021/10/15 Composites  C  C-SiC  Liquid silicon infiltration  TEM  Morphology  Interfacial microstructure   Effect of Interfacial Microstructure on Mechanical and Tribological Properties of Cu/WS2 Self-lubricating Composites Sintered by Spark Plasma Sintering 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2021, 页码: 12 作者:  Yu, Zhitao;  Chen, Minghui;  Wang, Qunchang;  Wang, Xiaolan;  Wang, Fuhui   |  收藏  |  浏览/下载：32/0  |  提交时间：2021/03/15 Self-lubricating composites  Interfacial microstructure  Wear  Fracture   TEM study on the microstructure of the interface at the scale of nanometer formed between Cu-8 wt.% Ti melt and C/C preform 期刊论文  OAI收割 MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 246, 页码: 8 作者:  Zhang, K. X.;  Guo, X. S.;  Zhao, W. K.   |  收藏  |  浏览/下载：8/0  |  提交时间：2021/02/02 Metal matrix composites  C/C preform  Reactive melt infiltration  Interfacial microstructure   TEM study on the microstructure of the interface at the scale of nanometer formed between Cu-8 wt.% Ti melt and C/C preform 期刊论文  OAI收割 MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 246, 页码: 8 作者:  Zhang, K. X.;  Guo, X. S.;  Zhao, W. K.;  Zhang, F. Q.;  He, L. L.   |  收藏  |  浏览/下载：16/0  |  提交时间：2021/02/02 Metal matrix composites  C/C preform  Reactive melt infiltration  Interfacial microstructure   Surface oxidation of PAN-based ultrahigh modulus carbon fibers (UHMCFs) and its effect on the properties of UHMCF/EP composites 期刊论文  OAI收割 CARBON LETTERS, 2020 作者:  Wang, Xinyu;  Qian, Xin;  Zhang, Yonggang;  Wang, Xuefei;  Song, Shulin   |  收藏  |  浏览/下载：124/0  |  提交时间：2020/12/16 INTERFACIAL PROPERTIES  MECHANICAL-PROPERTIES  ELECTROCHEMICAL OXIDATION  FIBER/EPOXY COMPOSITES  HIGH-STRENGTH  RAMAN-SPECTROSCOPY  MICROSTRUCTURE  HETEROGENEITY  MICROTEXTURE  BEHAVIORS   Low Contact Resistivity and Interfacial Behavior of p-Type NbFeSb/Mo Thermoelectric Junction 期刊论文  OAI收割 ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 15, 页码: 14182 作者:  Shen, Jiajun;  Wang, Zhenyi;  Chu, Jing;  Bai, Shengqiang;  Zhao, Xinbing   |  收藏  |  浏览/下载：72/0  |  提交时间：2019/12/26 thermoelectric materials  half-Heusler compounds  electrode  contact resistivity  interfacial microstructure  Ohmic contact