机构

• 金属研究所 [13]
• 力学研究所 [1]
• 宁波材料技术与工程研... [1]
• 合肥物质科学研究院 [1]
• 长春应用化学研究所 [1]

采集方式

• OAI收割 [17]

内容类型

• 期刊论文 [17]

发表日期

• 2021 [2]
• 2020 [3]
• 2019 [1]
• 2018 [1]
• 2012 [2]
• 2011 [3]
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学科主题

• Materials ... [1]
• Metallurgy... [1]
• Nanoscienc... [1]

筛选

浏览/检索结果: 共17条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Interfacial segregation and precipitation behavior of Cu-rich precipitates in Cu-bearing 316LN stainless steel after aging at different temperatures 期刊论文  OAI收割 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 805, 页码: 8 作者:  Xi, Tong;  Zhang, Xinrui;  Yin, Xueliang;  Yang, Chunguang;  Yang, Ke   |  收藏  |  浏览/下载：41/0  |  提交时间：2021/10/15 Copper precipitation  Mechanical property  316LN stainless Steel  Interfacial segregation  Atom probe tomography   Effect of dislocation configuration on Ag segregation in subgrain boundary of a Mg-Ag alloy 期刊论文  OAI收割 SCRIPTA MATERIALIA, 2021, 卷号: 191, 页码: 219-224 作者:  Xiao R;  Chen XF(陈雪飞);  Wei K;  Liu Y;  Yin DD   |  收藏  |  浏览/下载：47/0  |  提交时间：2020/11/30 Interfacial segregation  Nanocrystallization  Sub-grain boundary  HAADF-STEM  Mg alloy   Insight into interface cohesion and impurity-induced embrittlement in carbide dispersion strengthen tungsten from first principles 期刊论文  OAI收割 JOURNAL OF NUCLEAR MATERIALS, 2020, 卷号: 538 作者:  Wu, Xuebang;  Zhang, Xu;  Xie, Z. M.;  Li, Xiangyan;  Miranda, C. R.   |  收藏  |  浏览/下载：30/0  |  提交时间：2020/10/26 Interfaces  Cohesion  Interfacial segregation  Tungsten  First-principles calculations   Segregation and microstructural evolution at interfaces of atmospheric plasma sprayed thermal barrier coatings during thermal cycling 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 819, 页码: 13 作者:  Liu, Y. Z.;  Hu, X. B.   |  收藏  |  浏览/下载：16/0  |  提交时间：2021/02/02 Thermal barrier coatings (TBCs)  Microstructural evolution  Interfacial oxidation  Oxidation kinetics  Element segregation  Scanning transmission electron microscopy (STEM)   Segregation and microstructural evolution at interfaces of atmospheric plasma sprayed thermal barrier coatings during thermal cycling 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 819, 页码: 13 作者:     |  收藏  |  浏览/下载：18/0  |  提交时间：2021/02/02 Thermal barrier coatings (TBCs)  Microstructural evolution  Interfacial oxidation  Oxidation kinetics  Element segregation  Scanning transmission electron microscopy (STEM)   Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 20, 页码: 18524-18538 作者:  Wang, Z.;  Zhang, Q. K.;  Chen, Y. X.;  Song, Z. L.   |  收藏  |  浏览/下载：26/0  |  提交时间：2019/12/18 MECHANICAL-PROPERTIES  INTERFACIAL EMBRITTLEMENT  TENSILE PROPERTIES  SEGREGATION  MICROSTRUCTURE  TEMPERATURE  SUBSTRATE  BISMUTH  BEHAVIOR  GROWTH   Special segregation of Cu on the habit plane of lath-like beta' and QP2 precipitates in Al-Mg-Si-Cu alloys 期刊论文  OAI收割 SCRIPTA MATERIALIA, 2018, 卷号: 151, 页码: 33-37 作者:  Weng, YY;  Jia, ZH;  Ding, LP;  Du, K;  Duan, HC   |  收藏  |  浏览/下载：47/0  |  提交时间：2018/12/25 Al-Mg-Si-Cu alloys  Interfacial segregation  Precipitates  HAADF-STEM  Atomic structure   Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：22/0  |  提交时间：2013/02/05 Sn-Bi solder  Void  Cu3Sn  Bi segregation  Interfacial embrittlement  Cu  alloys  solder interconnect  grain-boundaries  single-crystal  bismuth  embrittlement  segregation  copper  strength   The manageable formation of the gradient-layered polymer/fullerene blend films via the addition of bathocuproine and their applications in organic solar cells 期刊论文  OAI收割 physica status solidi a-applications and materials science, 2012, 卷号: 209, 期号: 6, 页码: 1150-1156 Qin DS; Quan W; Liu JS; Li GF; Chen L; Zhang JD; Yan DH 收藏  |  浏览/下载：15/0  |  提交时间：2013/05/20 ACCEPTOR MOLECULAR HETEROJUNCTIONS  PHOTOVOLTAIC APPLICATIONS  INTERFACIAL SEGREGATION  ACTIVE LAYERS  POLY(3-HEXYLTHIOPHENE)  PERFORMANCE  SEPARATION   Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文  OAI收割 Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328 Q. K. Zhang; H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：21/0  |  提交时间：2012/04/13 Sn-Bi solder  Bi segregation  interfacial embrittlement  substrate  alloying  reflow temperature  tensile strength  lead-free solders  joints  microstructure  embrittlement  interconnect  bismuth  ag