机构

• 力学研究所 [3]
• 武汉物理与数学研究所 [2]
• 高能物理研究所 [2]
• 上海微系统与信息技术... [1]
• 自动化研究所 [1]

采集方式

• OAI收割 [8]
• iSwitch采集 [1]

内容类型

• 期刊论文 [9]

发表日期

• 2022 [1]
• 2018 [2]
• 2012 [1]
• 2011 [1]
• 2008 [1]
• 2007 [1]
• 更多

学科主题

• Engineerin... [1]
• 数学 [1]

筛选

浏览/检索结果: 共9条，第1-9条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Multimodal Unknown Surface Material Classification and Its Application to Physical Reasoning 期刊论文  OAI收割 IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, 2022, 2022, 卷号: 18, 18, 期号: 7, 页码: 4406-4416, 4406-4416 作者:  Wei, Junhang;  Cui, Shaowei;  Hu, Jingyi;  Hao, Peng;  Wang, Shuo   |  收藏  |   Monte carlo simulation of biological shielding parameters in pgnaa 期刊论文  iSwitch采集 Micro & nano letters, 2018, 卷号: 13, 期号: 4, 页码: 457-460 作者:  Yang, Jianbo;  Peng, Kexin;  Qiao, Yujie;  Zhang, Can;  Li, Rui 收藏  |   Monte Carlo simulation of biological shielding parameters in PGNAA 期刊论文  OAI收割 MICRO & NANO LETTERS, 2018, 卷号: 13, 期号: 4, 页码: 457-460 作者:  Li, R;  Yang, JB;  Peng, KX;  Qiao, YJ;  Zhang, C   |  收藏  |   Adaptively deformed mesh based interface method for elliptic equations with discontinuous coefficients 期刊论文  OAI收割 JOURNAL OF COMPUTATIONAL PHYSICS, 2012, 卷号: 231, 期号: 4, 页码: 1440-1461 作者:  Xia, Kelin;  Zhan, Meng;  Wan, Decheng;  Wei, Guo-Wei 收藏  |   MIB method for elliptic equations with multi-material interfaces 期刊论文  OAI收割 JOURNAL OF COMPUTATIONAL PHYSICS, 2011, 卷号: 230, 期号: 12, 页码: 4588-4615 作者:  Xia, Kelin;  Zhan, Meng;  Wei, Guo-Wei 收藏  |   Non-Slipping Jkr Model For Transversely Isotropic Materials 期刊论文  OAI收割 International Journal of Solids and Structures, 2008, 页码: 676-687 作者:  Chen SH(陈少华);  Yan C(闫聪);  Soh A 收藏  |   Bio-inspired mechanics of reversible adhesion: Orientation-dependent adhesion strength for non-slipping adhesive contact with transversely isotropic elastic materials 期刊论文  OAI收割 Journal of the Mechanics and Physics of Solids, 2007, 卷号: 55, 期号: 5, 页码: 1001-1015 作者:  Chen SH(陈少华);  Gao HJ(高华健) 收藏  |   Lifetime of solder joint and delamination in flip chip assemblies 期刊论文  OAI收割 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186 Cheng, ZN 收藏  |   Plane strain asymptotic fields for cracks terminating at the interface between elastic and pressure-sensitive dilatant materials 期刊论文  OAI收割 International Journal of Fracture, 1997, 卷号: 86, 期号: 4, 页码: 343-360 作者:  Yu HR(余宏荣);  Wu YL(吴永礼);  Li GC(李国琛) 收藏  |