机构

• 金属研究所 [14]
• 力学研究所 [3]
• 长春应用化学研究所 [3]
• 物理研究所 [1]
• 过程工程研究所 [1]
• 上海硅酸盐研究所 [1]
• 更多

采集方式

• OAI收割 [23]

内容类型

• 期刊论文 [23]

发表日期

• 2023 [2]
• 2022 [3]
• 2021 [1]
• 2019 [5]
• 2018 [1]
• 2012 [2]
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学科主题

• Materials ... [1]
• Metallurgy... [1]
• Nanoscienc... [1]
• 固体力学::岩体力学... [1]

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浏览/检索结果: 共23条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Improving the mechanical properties and electrical conductivity of cold-sprayed Cu-Ti3SiC2 composite by friction stir processing 期刊论文  OAI收割 COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2023, 卷号: 173, 页码: 10 作者:  Yang, Zhibin;  Wang, Jinming;  Li, Xingchao;  Wang, Yandong;  Ni, Dingrui   |  收藏  |   Effect of shear thickening gel on microstructure and impact resistance of ethylene vinyl acetate foam 期刊论文  OAI收割 COMPOSITE STRUCTURES, 2023, 卷号: 311, 页码: 116811 作者:  Tu H(涂欢);  Xu, Pengzhao;  Yang, Zhe;  Tang, Fan;  Dong, Cheng   |  收藏  |   Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文  OAI收割 COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7 作者:  Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong   |  收藏  |   Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文  OAI收割 COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7 作者:  Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong   |  收藏  |   Failure mechanism of nano-structural interfacial layer in Mg matrix composites reinforced with Cf 期刊论文  OAI收割 COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 154, 页码: 10 作者:  Wang, W. G.;  Zhang, J. F.;  Zan, Y. N.;  Liu, Z. Y.;  Wang, D.   |  收藏  |   Molecular dynamics simulation of the interface properties of continuous carbon fiber/polyimide composites 期刊论文  OAI收割 APPLIED SURFACE SCIENCE, 2021, 卷号: 563, 页码: 11 作者:  Yan, Yishu;  Xu, Junbo;  Zhu, Huajian;  Xu, Yinxiang;  Wang, Min   |  收藏  |   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |   Effect of compaction pressure on the densification, microstructure, and mechanical properties of Ti-1Al-8V-5Fe alloy based on TiH2 and HDH-Ti powders 期刊论文  OAI收割 MICRO & NANO LETTERS, 2019, 卷号: 14, 期号: 8, 页码: 906-910 作者:  Zhang, Yanan;  Guo, Xing;  Chen, Yungui;  Li, Qiangguo   |  收藏  |   Effect of compaction pressure on the densification, microstructure, and mechanical properties of Ti-1Al-8V-5Fe alloy based on TiH2 and HDH-Ti powders 期刊论文  OAI收割 MICRO & NANO LETTERS, 2019, 卷号: 14, 期号: 8, 页码: 906-910 作者:  Zhang, Yanan;  Guo, Xing;  Chen, Yungui;  Li, Qiangguo   |  收藏  |