中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
机构
采集方式
内容类型
发表日期
学科主题
筛选

浏览/检索结果: 共23条,第1-10条 帮助

条数/页: 排序方式:
Improving the mechanical properties and electrical conductivity of cold-sprayed Cu-Ti3SiC2 composite by friction stir processing 期刊论文  OAI收割
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2023, 卷号: 173, 页码: 10
作者:  
Yang, Zhibin;  Wang, Jinming;  Li, Xingchao;  Wang, Yandong;  Ni, Dingrui
  |  收藏  |  浏览/下载:7/0  |  提交时间:2024/01/08
Effect of shear thickening gel on microstructure and impact resistance of ethylene vinyl acetate foam 期刊论文  OAI收割
COMPOSITE STRUCTURES, 2023, 卷号: 311, 页码: 116811
作者:  
Tu H(涂欢);  Xu, Pengzhao;  Yang, Zhe;  Tang, Fan;  Dong, Cheng
  |  收藏  |  浏览/下载:20/0  |  提交时间:2023/04/20
Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文  OAI收割
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7
作者:  
Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong
  |  收藏  |  浏览/下载:17/0  |  提交时间:2023/05/09
Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文  OAI收割
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7
作者:  
Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong
  |  收藏  |  浏览/下载:25/0  |  提交时间:2023/05/09
Failure mechanism of nano-structural interfacial layer in Mg matrix composites reinforced with Cf 期刊论文  OAI收割
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 154, 页码: 10
作者:  
Wang, W. G.;  Zhang, J. F.;  Zan, Y. N.;  Liu, Z. Y.;  Wang, D.
  |  收藏  |  浏览/下载:34/0  |  提交时间:2022/07/01
Molecular dynamics simulation of the interface properties of continuous carbon fiber/polyimide composites 期刊论文  OAI收割
APPLIED SURFACE SCIENCE, 2021, 卷号: 563, 页码: 11
作者:  
Yan, Yishu;  Xu, Junbo;  Zhu, Huajian;  Xu, Yinxiang;  Wang, Min
  |  收藏  |  浏览/下载:33/0  |  提交时间:2022/06/15
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  
Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
  |  收藏  |  浏览/下载:23/0  |  提交时间:2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  
Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
  |  收藏  |  浏览/下载:19/0  |  提交时间:2021/02/02
Effect of compaction pressure on the densification, microstructure, and mechanical properties of Ti-1Al-8V-5Fe alloy based on TiH2 and HDH-Ti powders 期刊论文  OAI收割
MICRO & NANO LETTERS, 2019, 卷号: 14, 期号: 8, 页码: 906-910
作者:  
Zhang, Yanan;  Guo, Xing;  Chen, Yungui;  Li, Qiangguo
  |  收藏  |  浏览/下载:237/0  |  提交时间:2021/02/02
Effect of compaction pressure on the densification, microstructure, and mechanical properties of Ti-1Al-8V-5Fe alloy based on TiH2 and HDH-Ti powders 期刊论文  OAI收割
MICRO & NANO LETTERS, 2019, 卷号: 14, 期号: 8, 页码: 906-910
作者:  
Zhang, Yanan;  Guo, Xing;  Chen, Yungui;  Li, Qiangguo
  |  收藏  |  浏览/下载:110/0  |  提交时间:2021/02/02