机构

• 半导体研究所 [4]
• 自动化研究所 [1]
• 新疆天文台 [1]

采集方式

• OAI收割 [4]
• iSwitch采集 [2]

内容类型

• 会议论文 [3]
• 期刊论文 [3]

发表日期

• 2020 [1]
• 2007 [2]
• 2005 [2]
• 1999 [1]

学科主题

• 光电子学 [2]

筛选

浏览/检索结果: 共6条，第1-6条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules 会议论文  OAI收割 Hong Kong, China, August 12, 2019 - August 15, 2019 作者:  Tian, Jun;  Wang, Congsi;  Liu, Shaoyi;  Zhu, Cheng;  Zhou, Cheng   |  收藏  |  浏览/下载：41/0  |  提交时间：2021/07/06 Microwave circuits  Belts  Electronics packaging  Flexible electronics  Gold  Integrated circuit interconnects  Microwaves  Timing circuits   Characterization of parasitics in to-packaged high-speed laser modules 期刊论文  iSwitch采集 Ieee transactions on advanced packaging, 2007, 卷号: 30, 期号: 1, 页码: 97-103 作者:  Chen, Cheng;  Zhu, Ning Hua;  Zhang, Shang Jian;  Liu, Yu 收藏  |  浏览/下载：33/0  |  提交时间：2019/05/12 Equivalent circuits  Intrinsic laser  Microwave packaging  Semiconductor laser  Through hole (to) packaging   Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices 期刊论文  iSwitch采集 Ieee transactions on advanced packaging, 2007, 卷号: 30, 期号: 1, 页码: 34-37 作者:  Yang, H.;  Zhu, H. L.;  Xie, H. Y.;  Zhao, L. J.;  Zhou, F. 收藏  |  浏览/下载：31/0  |  提交时间：2019/05/12 Coplanar waveguide (cpw)  Low microwave loss  High-frequency  Optoelectronic packaging  Passive coupling  Silicon bench  V-groove   Microwave packaging for 10 Gb/s EML modulators - art. no. 60201O 会议论文  OAI收割 conference on optoelectronic materials and devices for optical communications, shanghai, peoples r china, nov 07-10, 2005 Liu, Y; Xie, L; Yuan, HQ; Zhang, JB; Zhu, NH; Sun, CZ; Xiong, B; Luo, B 收藏  |  浏览/下载：89/17  |  提交时间：2010/03/29 optoelectronic devices  electro-absorption modulators  microwave packaging  frequency response  DESIGN   Design and Fabrication of Low-microwave loss Coplannar Waveguide and precise V groove on Silicon Substrate for Optoelectronic Packaging - art. no. 601938 会议论文  OAI收割 conference on passive components and fiber-based devices ii, shanghai, peoples r china, nov 07-10, 2005 Yang, H; Zhu, HL; Xie, HY; Zhao, LJ; Zhou, F; Wang, W 收藏  |  浏览/下载：116/22  |  提交时间：2010/03/29 coplanar waveguide (CPW)  V groove  low microwave loss  passive coupling  optoelectronic packaging   Three-step precise robotic peg-hole insertion operation with symmetric regular polyhedral objects 期刊论文  OAI收割 International Journal of Production Research, 1999, 卷号: 37, 期号: 15, 页码: 3541-3563 作者:  Qiao,Hong;  Tso, S. K. 收藏  |  浏览/下载：19/0  |  提交时间：2016/12/06 overall migration  microwave  food packaging  aqueous simulants