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中国科学院机构知识库网格

Chinese Academy of Sciences Institutional Repositories Grid

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	Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates 期刊论文 OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 7, 页码: 1156-1163 作者: Zhang, Bowen; Zhao, Zhiyuan; Liu, Yi; Ma, Haoxiang; Shi, Chao \| 收藏 \| 浏览/下载：18/0 \| 提交时间：2024/10/21 Substrates Annealing Silver Nanoscale devices Sputtering Nanostructures Bonding Nano-gradient structure power electronic packaging reliability silver paste strength-ductility dilemma
	Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics 期刊论文 OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 1, 页码: 10-17 作者: Zhang, Bowen; Lu, Xinyan; Ma, Haoxiang; Wang, Di; Mei, Yun-Hui \| 收藏 \| 浏览/下载：18/0 \| 提交时间：2024/05/07 Silver Sintering Force Substrates Copper Bonding Thermal stability Reliability packaging silver paste sintering driving force
	Preparation and Properties of Glass Cloth-Reinforced Polyimide Composites with Improved Impact Toughness for Microelectronics Packaging Substrates 期刊论文 OAI收割 JOURNAL OF APPLIED POLYMER SCIENCE, 2010, 卷号: 117, 期号: 2, 页码: 1173-1183 作者: Xu, Hong-Yan; Yang, Hai-Xia; Tao, Li-Ming; Fan, Lin; Yang, Shi-Yong \| 收藏 \| 浏览/下载：25/0 \| 提交时间：2019/04/09 Thermosetting Polyimide Glass Cloth-reinforced Composite Mechanical Properties Isothermal Stability Packaging Substrates