机构

• 长春光学精密机械与物... [2]
• 计算技术研究所 [1]
• 上海技术物理研究所 [1]
• 西安光学精密机械研究... [1]

采集方式

• OAI收割 [5]

内容类型

• 会议论文 [4]
• 期刊论文 [1]

发表日期

• 2023 [1]
• 2020 [1]
• 2017 [1]
• 2006 [2]

学科主题

筛选

浏览/检索结果: 共5条，第1-5条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Chiplet技术发展现状 期刊论文  OAI收割 科技导报, 2023, 卷号: 41, 期号: 19, 页码: 113 作者:  项少林;  郭茂;  蒲菠;  方刘禄;  刘淑娟   |  收藏  |  浏览/下载：33/0  |  提交时间：2024/05/20 chiplet technology  chiplet interconnect interfaces  advanced packaging  multi physical field electronic assisted design  signal and power integrity  chiplet技术  芯粒互连接口  先进封装  多物理场电子辅助设计  信号与电源完整性   High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文  OAI收割 San Francisco, CA, United states, 2020-02-03 作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning   |  收藏  |  浏览/下载：27/0  |  提交时间：2020/05/18 High power  low smile  conductive cooling  packaging technology   An introduction of resistive arrays and packaging technology 会议论文  OAI收割 作者:  Sun Q;  Liu DF;  Gong HM   |  收藏  |  浏览/下载：31/0  |  提交时间：2018/11/20 Resistor arrays  Packaging technology  Infrared scene simulation   The structure design and packaging of the polarization-maintaining dual fiber collimator based on DFT (EI CONFERENCE) 会议论文  OAI收割 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, June 27, 2005 - June 29, 2005, Shanghai, China 作者:  Wang Z.;  Qiu J.;  Wang Z. 收藏  |  浏览/下载：23/0  |  提交时间：2013/03/25 Examinable characteristic is an important parameter to measure and ensure the function and quality of the products. Based on the idea of DFA/M(Design For Assembly/Design For Manufacturability) and the method whether the target for low insertion loss and high reflection loss is implemented  the rational structure and assembly technics for the polarization-maintaining dual fiber collimator are discussed  and the packaging technology based on DFT of the polarization-maintaining dual fiber collimator is proposed. This method has been utilized in batch manufacture to enhance the efficiency and ensure the eligible ratio.   The packaging technology of optical switch arrays (EI CONFERENCE) 会议论文  OAI收割 ICO20: MEMS, MOEMS, and NEMS, August 21, 2005 - August 26, 2005, Changchun, China 作者:  Chen W.;  Wang W.;  Zhao L.;  Wang W.;  Wang L. 收藏  |  浏览/下载：22/0  |  提交时间：2013/03/25 Optical switch is one of key supporting technologies in all-optical-network (AON). And electrostatic MOEMS (Micro-Optical-Electro-Mechanical Systems) switch plays a very important role in all the researched switches  because of their excellent features  including low insertion  low crosstalk and scalability. But the packaging technology has been limiting the development of optical switch. In this paper  the authors study the laser beam propagating during the free space and select collimator  design the pedestal to packaging and address aspects of the insertion loss that are most important loss mechanisms for the 2D cross-connect switch.