机构

• 力学研究所 [2]
• 长春光学精密机械与物... [1]
• 长春应用化学研究所 [1]
• 西安光学精密机械研究... [1]

采集方式

• OAI收割 [5]

内容类型

• 期刊论文 [3]
• 会议论文 [2]

发表日期

• 2022 [1]
• 2014 [1]
• 2011 [1]
• 2008 [1]
• 2004 [1]

学科主题

• Physics [1]

筛选

浏览/检索结果: 共5条，第1-5条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Telecom-compatible, on-chip generation and processing of complex photon states in time and frequency 会议论文  OAI收割 Virtual, Online, 2022-02-20 作者:  Chemnitz, Mario;  Yu, Hao;  Sciara, Stefania;  Fischer, Bennet;  Roztocki, Piotr   |  收藏  |  浏览/下载：37/0  |  提交时间：2022/07/14 integrated quantum optics  complex photon states  quantum frequency combs  silicon-based chips  microring resonators  spiral waveguide  integrated Mach-Zehnder interferometer  discrete time and frequency modes  photonic qubits and qudits   Bubble dynamics in nucleate pool boiling on micro-pin-finned surfaces in microgravity 期刊论文  OAI收割 APPLIED THERMAL ENGINEERING, 2014, 卷号: 70, 期号: 1, 页码: 172-182 作者:  Zhang YH;  Wei JJ;  Xue YF;  Kong X;  Zhao JF(赵建福) 收藏  |  浏览/下载：24/0  |  提交时间：2014/11/03 HEAT-TRANSFER  SILICON CHIPS  FC-72  DEPARTURE  FINS   Bubble Behavior and Heat Transfer of Nucleate Pool Boiling on Micro-Pin-Finned Surface in Microgravity 期刊论文  OAI收割 Chinese Physics Letters, 2011, 卷号: 28, 期号: 1, 页码: 16401 作者:  Wei JJ;  Xue Y;  Zhao JF(赵建福);  Li J(李晶) 收藏  |  浏览/下载：24/0  |  提交时间：2012/04/01 Silicon Chips  Fc-72   Glass wafers bonding via Diels-Alder reaction at mild temperature 期刊论文  OAI收割 sensors and actuators a-physical, 2008, 卷号: 141, 期号: 1, 页码: 213-216 Zhang MJ; Zhao HY; Gao LX 收藏  |  浏览/下载：19/0  |  提交时间：2010/04/14 SILICON-ON-INSULATOR  MICROFLUIDIC CHIPS  TECHNOLOGIES  FABRICATION  SYSTEM  FILMS  LAYER  MEMS   Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文  OAI收割 MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China 作者:  Wang W.;  Wang L.;  Wang L.;  Wang L.;  Chen W. 收藏  |  浏览/下载：32/0  |  提交时间：2013/03/25 We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.