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CAS IR Grid
机构
长春光学精密机械与物... [2]
海洋研究所 [1]
采集方式
OAI收割 [3]
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会议论文 [2]
期刊论文 [1]
发表日期
2019 [1]
2005 [1]
2004 [1]
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Cumulative impact of long-term intensive mariculture on total and active bacterial communities in the core sediments of the Ailian Bay, North China
期刊论文
OAI收割
SCIENCE OF THE TOTAL ENVIRONMENT, 2019, 卷号: 691, 页码: 1212-1224
作者:
Liang, Yantao
;
Zhang, Yongyu
;
Zhou, Chao
;
Li, Hongmei
;
Kang, Xuming
  |  
收藏
  |  
浏览/下载:52/0
  |  
提交时间:2020/03/20
Bacterial community
Mariculture
Total and active
Core sediments
MiSeq sequencing
High-power InGaAs/GaAs VCSEL's two-dimension arrays (EI CONFERENCE)
会议论文
OAI收割
ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China
作者:
Liu Y.
;
Wang L.-J.
;
Wang L.-J.
;
Liu Y.
;
Liu Y.
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2013/03/25
Selectively oxidized InGaAs/GaAs vertical -cavity surface-emitting lasers (VCSEL) array at an emission wavelength of 980nm was reported. A 16 elements array with 200m aperture size (250m center spacing) of individual elements shows a CW output power of 1.21 W at room temperature
resulting in 1 KW/cm2 average optical power density. The device threshold current is 1.32A The lasing peak wavelength is 981.9 nm
the full width at half-maximum is 0.7 nm
and the far-field divergence angle is about 17.The characteristics of a single device with a active region diameter of 800m is compared with that of a 2-D array with active region diameter of individual clement of 200m. These two kinds of devices have the same total lasing area. At the same current injection
the single device has a higher threshold and a higher output power than the array. The red shift of single device is more obvious than that of the array's.
Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE)
会议论文
OAI收割
MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China
作者:
Wang W.
;
Wang L.
;
Wang L.
;
Wang L.
;
Chen W.
收藏
  |  
浏览/下载:32/0
  |  
提交时间:2013/03/25
We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges
Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment
thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in
sixteen V-grooves for optical fibers
and micropits for micro ball lenses
all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners
where different geometries meet. Through this assembling method
the fiber
micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.