机构

• 金属研究所 [2]
• 苏州纳米技术与纳米仿... [1]
• 数学与系统科学研究院 [1]
• 合肥物质科学研究院 [1]

采集方式

• OAI收割 [5]

内容类型

• 期刊论文 [5]

发表日期

• 2024 [2]
• 2022 [1]
• 2018 [1]
• 2015 [1]

学科主题

筛选

浏览/检索结果: 共5条，第1-5条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择作者升序作者降序发表日期升序发表日期降序题名升序题名降序提交时间升序提交时间降序 Joined AZ31B Magnesium Alloys with Ag Interlayer by Ultrasonic-Induced Transient Liquid Phase Bonding in Air 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2024, 页码: 9 作者:  Wang, Qian;  Yu, Peng;  Lin, Haoran;  Guo, Chongzhi;  Hu, Xiaoqiang   |  收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27 Ultrasonic bonding  Magnesium alloy  Silver  Microstructure  Intermetallic compound   Joined AZ31B Magnesium Alloys with Ag Interlayer by Ultrasonic-Induced Transient Liquid Phase Bonding in Air 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2024, 页码: 9 作者:  Wang, Qian;  Yu, Peng;  Lin, Haoran;  Guo, Chongzhi;  Hu, Xiaoqiang   |  收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27 Ultrasonic bonding  Magnesium alloy  Silver  Microstructure  Intermetallic compound   Automated immersion ultrasonic testing technology for debonding defects of the brazed joint of DOME in EAST divertor 期刊论文  OAI收割 FUSION ENGINEERING AND DESIGN, 2022, 卷号: 176 作者:  Wang, Rui;  Li, Bo;  Jiang, Beiyan;  Liu, Zhihong;  Zhou, Nengtao   |  收藏  |  浏览/下载：72/0  |  提交时间：2022/05/16 EAST divertor  Interface  Bonding defects  Ultrasonic testing technology   Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure 期刊论文  OAI收割 SENSORS AND ACTUATORS A-PHYSICAL, 2018, 卷号: 281, 页码: 1-8 作者:  Li, Zhenhao;  Na, Shuai;  Chen, Albert I. H.;  Wong, Lawrence L. P.;  Sun, Zhendong   |  收藏  |  浏览/下载：58/0  |  提交时间：2018/11/16 Capacitive micromachined ultrasonic transducer  Adhesive wafer bonding  Photosensitive benzocyclobutene  Resonator   Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient 期刊论文  OAI收割 Micro & Nano Letters, 2015, 卷号: 10, 期号: 10, 页码: 4 作者:  Miao, J(苗静);  Shen, WJ(沈文江);  He, CD;  Xue, CY;  Xiong, JJ 收藏  |  浏览/下载：115/0  |  提交时间：2015/12/31 silicon  elemental semiconductors  silicon-on-insulator  wafer bonding  electromechanical effects  ultrasonic transducers  capacitive transducers  micromechanical devices  micromachining  vibrations  membranes  finite element analysis  reliability  capacitance  electromechanical coupling coefficient  capacitive micromachined ultrasonic transducer  impedance matching  propagation medium  microelectromechanical system capacitive ultrasonic transducer  silicon on insulator  wafer bonding  optimum geometric dimensions  membrane mechanical vibration  electrical characteristics  finite-element analysis  operation mode  device safety  device reliability  equivalent stress  operation-collapse voltage  bottom electrodes  glass substrate surface  parallel parasitic capacitance  Si  SiO2