中国科学院机构知识库网格系统: 检索

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	High-temperature BaTiO₃-based ceramic capacitors by entropy engineering design 期刊论文 OAI收割 JOURNAL OF ADVANCED CERAMICS, 2024, 卷号: 13 作者: Song, Yan; Zhang, Min; Lan, Shun; Yang, Bingbing; Liu, Yiqian \| 收藏 \| 浏览/下载：10/0 \| 提交时间：2024/11/20 BaTiO3-based ceramics high-entropy effects high-temperature energy storage cycling reliability
	Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文 OAI收割 IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187 作者: Zhang, Hui; Li, Jianfeng; Dai, Jingru; Corfield, Martin; Liu, Xuejian \| 收藏 \| 浏览/下载：42/0 \| 提交时间：2018/12/28 Electronic packaging finite-element (FE) method material reliability planar power module power cycling X-ray computation tomography
	Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文 OAI收割 Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933 H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai 收藏 \| 浏览/下载：34/0 \| 提交时间：2015/01/14 Fe-Ni alloy Under bump metallization (UBM) Intermetallic compound (IMC) Reliability High temperature storage Temperature cycling lead-free solders intermetallic compounds growth-kinetics cu metallization ag strength ball ubm
	Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling 期刊论文 OAI收割 Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91 W. Wang; Z. G. Wang; A. P. Xian; J. K. Shang 收藏 \| 浏览/下载：20/0 \| 提交时间：2012/04/13 CBGA thermal cycling FEM assembly cracking solder joint reliability level reliability flex-substrate interconnect snagcu bga segregation packages behavior bismuth