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Chinese Academy of Sciences Institutional Repositories Grid
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浏览/检索结果: 共5条，第1-5条 帮助

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Chiplet技术发展现状 期刊论文  OAI收割
科技导报, 2023, 卷号: 41, 期号: 19, 页码: 113
作者:  项少林;  郭茂;  蒲菠;  方刘禄;  刘淑娟
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High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文  OAI收割
San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning
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An introduction of resistive arrays and packaging technology 会议论文  OAI收割
作者:  Sun Q;  Liu DF;  Gong HM
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The structure design and packaging of the polarization-maintaining dual fiber collimator based on DFT (EI CONFERENCE) 会议论文  OAI收割
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, June 27, 2005 - June 29, 2005, Shanghai, China
作者:  Wang Z.;  Qiu J.;  Wang Z.
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The packaging technology of optical switch arrays (EI CONFERENCE) 会议论文  OAI收割
ICO20: MEMS, MOEMS, and NEMS, August 21, 2005 - August 26, 2005, Changchun, China
作者:  Chen W.;  Wang W.;  Zhao L.;  Wang W.;  Wang L.
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