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Chinese Academy of Sciences Institutional Repositories Grid
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Metal-Organic Framework Derived PdCu/C as an Efficient Catalyst for Electroless Copper Deposition 会议论文  OAI收割
上海, 2018
作者:  Jiahui Chen;  Huangqing Ye;  Jinqi Xie;  Changzeng Yan;  Rong Sun
  |  收藏  |  浏览/下载：26/0  |  提交时间：2019/01/31
Enhancement of thermal conductivity of epoxy adhesives by ball milling copper flakes 会议论文  OAI收割
Harbin, China
作者:  Lu Xu;  Hao-Ran Wen;  Futao Zhang;  Matthew M.F. Yuen;  Xian-Zhu Fu
  |  收藏  |  浏览/下载：17/0  |  提交时间：2018/02/02
Hollow PdCu Alloy Catalysts for Electroless Copper/Nickel Deposition 会议论文  OAI收割
Harbin, China
作者:  Guoqing Sheng;  Jiahui Chen;  Futao Zhang;  Matthew M.F. Yuen;  Xian-Zhu Fu
  |  收藏  |  浏览/下载：22/0  |  提交时间：2018/02/02
High efficient Pd-based bimetallic alloyed catalyst for electroless deposition of metalic copper 会议论文  OAI收割
Harbin, China
作者:  Jia-Li Sheng;  Jia-Hui Kang;  Xian-Zhu Fu;  Rong Sun;  Ching-Ping Wong
  |  收藏  |  浏览/下载：12/0  |  提交时间：2018/02/02
PdCu alloy nanoparticles supported on reduced graphene oxide as active catalyst for electroless copper plating 会议论文  OAI收割
Harbin, China
作者:  Huang-Qing Ye;  Da-Sha Mao;  Matthew M.F. Yuen;  Xian-Zhu Fu;  Rong Sun
  |  收藏  |  浏览/下载：18/0  |  提交时间：2018/02/02
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 会议论文  OAI收割
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Luo, Rongfeng;  Ren, Kuili;  Ma, Shenglin;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载：42/0  |  提交时间：2017/01/15
Oxidation Resistant core-shell Cu@SiO2 Nanowires for Composites with High Dielectric Performance 会议论文  OAI收割
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yanbin Shen;  Chengliang Li;  Suibin Luo;  Shuhui Yu;  Rong Sun
收藏  |  浏览/下载：14/0  |  提交时间：2017/01/15
Fabrication of Flexible conductive composites based on copper nanowires 会议论文  OAI收割
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Yu Zhu;  Yougen Hu;  Pengli Zhu;  Tao Zhao;  Xianwen Liang
收藏  |  浏览/下载：19/0  |  提交时间：2017/01/15
Electroplating Fabrication and Characterization of Sn-Ag Eutectic Solder Films 会议论文  OAI收割
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Jinqi Xie;  Zhe Zhong;  Kai Zhang;  Matthew M.F. Yuen;  S.W. Ricky Lee
收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15
FORMATION OF COPPER@SILVER CORE-SHELL NANOPARTICLES WITH EXCELLENT ANTIOXIDATION FOR INK-JET PRINTING 会议论文  OAI收割
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Qionglin Ouyang;  Gang Li;  Yu Zhang;  PengliZhu;  Qian Guo
收藏  |  浏览/下载：14/0  |  提交时间：2017/01/15