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浏览/检索结果: 共55条，第1-10条 帮助 限定条件 专题：上海微系统与信息技术研究所    第一署名单位    第一作者单位    通讯作者单位     条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Weak localization in few-layer graphene grown on copper foils by chemical vapor deposition 期刊论文  OAI收割 CARBON, 2012, 卷号: 50, 期号: 14, 页码: 5242-5246 Wang, WR; Chen, L; Wang, Z; Wang, YC; Li, T; Wang, YL 收藏  |   Weak localization in few-layer graphene grown on copper foils by chemical vapor deposition 期刊论文  OAI收割 CARBON, 2012, 卷号: 50, 期号: 14, 页码: 5242-5246 Wang, WR; Chen, L; Wang, Z; Wang, YC; Li, T; Wang, YL（重点实验室） 收藏  |   聚苯乙烯/氧化硅核壳型复合磨料的制备及其在铜化学机械抛光的应用研究 学位论文  OAI收割 硕士, 北京: 中国科学院研究生院（上海微系统与信息技术研究所）  , 2011 张磊 收藏  |   Preparation of monodisperse polystyrene/silica core-shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper 期刊论文  OAI收割 APPLIED SURFACE SCIENCE, 2011, 卷号: 258, 期号: 3, 页码: 1217-1224 Zhang,L; Wang,HB; Zhang,ZF; Qin,F; Liu,WL; Song,ZT 收藏  |   Preparation of monodisperse polystyrene/silica core-shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper 期刊论文  OAI收割 APPLIED SURFACE SCIENCE, 2011, 卷号: 258, 期号: 3, 页码: 1217-1224 Zhang, L; Wang, HB; Zhang, ZF; Qin, F; Liu, WL; song, zt(重点实验室） 收藏  |   A MICROFLUIDIC SENSOR CHIP WITH RENEWABLE IN-SITU COPPER MODIFIED MICROELECTRODE FOR CONTINUOUS MONITORING OF NITRATE 会议论文  OAI收割 Transducers’11:The 16th International Conference on Solid-State Sensors, Actuators and Microsystems, 2011 Yang Li, Jizhou Sun, Chao Bian, Jianhua Tong and Shanhong Xia 收藏  |   Study on the structure and hydrogen storage characteristics of as-cast La0.7Mg0.3Ni3.2Co0.35-xCux alloys 期刊论文  OAI收割 INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2010, 卷号: 35, 期号: 16, 页码: 8592-8596 Huang, TZ; Wu, Z; Han, JT; Sun, GX; Yu, JM; Cao, XQ; Xu, NX; Zhang, YH 收藏  |   The Acute Pulmonary Toxicity in Mice Induced by Multiwall Carbon Nanotubes, Benzene, and Their Combination 期刊论文  OAI收割 ENVIRONMENTAL TOXICOLOGY, 2010, 卷号: 25, 期号: 4, 页码: 409-417 Li, YS; Li, YF; Li, QN; Li, JG; Li, J; Huang, Q; Li, WX 收藏  |   Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device 期刊论文  OAI收割 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2009, 卷号: 32, 期号: 3, 页码: 125-132 Cao, YH; Ning, WG; Luo, L 收藏  |   Microstructure and electrochemical investigations of La0.76-xCexMg0.24Ni3.15Co0.245Al0.105 (x=0, 0.05, 0.1, 0.2, 0.3, 0.4) hydrogen storage alloys 期刊论文  OAI收割 INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2009, 卷号: 34, 期号: 19, 页码: 8073-8078 Cheng, LF; Wang, YX; Wang, RB; Pu, ZH; Zhang, XG; He, DN 收藏  |