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Chinese Academy of Sciences Institutional Repositories Grid
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  • 深圳先进技术研究院 [17]
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  • 会议论文 [17]
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浏览/检索结果: 共17条，第1-10条 帮助

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Fabricating 3D BT-BN/epoxy Composites with High Dielectric Performance 会议论文  OAI收割
上海, 2018
作者:  Xiaodong Zhu;  Suibin Luo;  Shuhui Yu;  Baojin Chu;  Rong Sun
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Interconnecting the Promising Mxenes via Ag Nanowire in Epoxy Nanocomposites for High-Performance Thermal Management Applications 会议论文  OAI收割
上海, 2018
作者:  Changzeng Yan;  Chao Ji;  Jiahui Chen;  Xiaoliang Zeng;  Rong Sun
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Hierarchically Interconnected Epoxy/BN-SCMC Polymer Composites with Enhanced Thermal Conductivity 会议论文  OAI收割
Harbin, China
作者:  Jiantao Hu;  Xiaoliang Zeng;  Rong Sun;  Jian-Bin Xu;  Ching-Ping Wong
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Surface modification of nano-size SiO2 filler for flip chip underfill applications 会议论文  OAI收割
Harbin
作者:  Gang Li;  yachuan He;  Pengli Zhu;  Tao Zhao;  Rong Sun
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Fabrication and Thermal Conduction Mechanism of Epoxy/Modified SiCNP Polymer Composites 会议论文  OAI收割
Harbin, China
作者:  Yun Huang;  Xiaoliang Zeng;  Rong Sun;  Jian-bin Xu;  Ching-ping Wong
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Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity 会议论文  OAI收割
Harbin, China
作者:  Jinze Li;  Baotan Zhang;  Pengli Zhu;  Gang Li;  Rong Sun
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A Novel Organic Substrate with Enhanced Thermal Conductivity 会议论文  OAI收割
Orlando，the USA
作者:  Xiaoliang Zeng;  Yimin Yao;  Yougen Hu;  Kun Guo;  Jiajia Sun
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Nano artifical red cells with sufficient oxygen supply for boosted photodynamic therapy 会议论文  OAI收割
SIPCD2016(Fourth Symposium on Innovative Polymers for Controlled Delivery), 中国苏州
作者:  Zhenyu Luo;  Mingbin Zheng;  Pengfei Zhao;  Ze Chen;  Lintao Cai
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Enhanced dielectric performance of PVDF composites with Graphene-BaTiO3 nanohybrids as fillers 会议论文  OAI收割
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Yunming Li;  Wenhu Yang;  Xiaodong Gao;  Chengliang Li;  Shuhui Yu
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Oxidation Resistant core-shell Cu@SiO2 Nanowires for Composites with High Dielectric Performance 会议论文  OAI收割
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yanbin Shen;  Chengliang Li;  Suibin Luo;  Shuhui Yu;  Rong Sun
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