机构

• 金属研究所 [5]

采集方式

• OAI收割 [5]

内容类型

• 期刊论文 [5]

发表日期

• 2019 [2]
• 2018 [3]

学科主题

• Engineerin... [1]
• Materials ... [1]
• Physics, A... [1]
• Physics, C... [1]

筛选

浏览/检索结果: 共5条，第1-5条 帮助 限定条件 专题：金属研究所    第一署名单位    第一作者单位    通讯作者单位     条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850 作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02 Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850 作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：9/0  |  提交时间：2021/02/02 The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781 作者:  Du, YH;  Liu, ZQ;  Ji, HJ;  Li, MY;  Wen, M   |  收藏  |  浏览/下载：14/0  |  提交时间：2018/12/25 The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781 作者:  Du, Yahong;  Liu, Zhi-Quan;  Ji, Hongjun;  Li, Mingyu;  Wen, Ming   |  收藏  |  浏览/下载：8/0  |  提交时间：2021/02/02 The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781 作者:  Du, Yahong;  Liu, Zhi-Quan;  Ji, Hongjun;  Li, Mingyu;  Wen, Ming   |  收藏  |  浏览/下载：9/0  |  提交时间：2021/02/02