机构

• 西安光学精密机械研... [25]
• 自动化研究所 [1]

采集方式

• OAI收割 [26]

内容类型

• 专利 [14]
• 会议论文 [11]
• 期刊论文 [1]

发表日期

• 2022 [1]
• 2019 [1]
• 2018 [2]
• 2017 [2]
• 2016 [3]
• 2015 [1]
• 更多

学科主题

• optics [2]
• physics, a... [2]
• computer a... [1]
• lasers, ge... [1]
• light/opti... [1]
• mathematic... [1]
• 更多

筛选

浏览/检索结果: 共26条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 DFANet: Dense Feature Augmentation Network for Printed Circuit Board Segmentation 会议论文  OAI收割 Haikou, China, 2022-08 作者:  Jie, Qin;  Jiayu, Zou;  Donghui, Li;  Xingang, Wang   |  收藏  |  浏览/下载：5/0  |  提交时间：2023/04/26 Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文  OAI收割 San Francisco, CA, 2019-02-04 作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie   |  收藏  |  浏览/下载：53/0  |  提交时间：2019/06/28 Diode Laser Stack  Hard Solder  High Power  Stress  Annular   Three-dimensions thermal model of a high-power diode laser bar 期刊论文  OAI收割 APPLIED OPTICS, 2018, 卷号: 57, 期号: 33, 页码: 9868-9876 作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng   |  收藏  |  浏览/下载：22/0  |  提交时间：2018/12/10 High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文  OAI收割 San Francisco, CA, United states, 2018-01-30 作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou   |  收藏  |  浏览/下载：71/0  |  提交时间：2018/04/25 Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文  OAI收割 components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31 作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai 收藏  |  浏览/下载：77/0  |  提交时间：2017/06/08 High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文  OAI收割 novel in-plane semiconductor lasers xvi 2017, san francisco, ca, united states, 2017-01-30 作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang 收藏  |  浏览/下载：24/0  |  提交时间：2017/07/06 Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling 收藏  |  浏览/下载：40/0  |  提交时间：2016/11/22 Computer simulation  Electronics packaging  High power lasers  Numerical models  Occupational risks  Optical properties  Packaging  Power semiconductor diodes  Shear stress  Thermal stress   High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文  OAI收割 conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16 作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning 收藏  |  浏览/下载：15/0  |  提交时间：2016/10/18 Horizontal array  Hard Solder  Spetrum Control   Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文  OAI收割 conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16 作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng 收藏  |  浏览/下载：11/0  |  提交时间：2016/10/18 diode laser  MCC  hard solder  high power   Integrated heat-assisted magnetic recording head/laser assembly 专利  OAI收割 专利号: US9070387, 申请日期: 2015-06-30, 公开日期: 2015-06-30 作者:  DEMTCHOUK, ALEXANDER V.;  GONG, YONGPING   |  收藏  |  浏览/下载：8/0  |  提交时间：2019/12/23