机构

• 深圳先进技术研究院 [18]
• 西安光学精密机械研究... [4]
• 兰州化学物理研究所 [2]
• 中国科学院大学 [1]

采集方式

• OAI收割 [24]
• iSwitch采集 [1]

内容类型

• 期刊论文 [13]
• 会议论文 [8]
• 专利 [4]

发表日期

• 2017 [1]
• 2016 [6]
• 2015 [8]
• 2014 [6]
• 2009 [1]
• 2007 [3]
• 更多

学科主题

• 材料科学与物理化学 [2]

筛选

浏览/检索结果: 共25条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Study on the effects of interfacial interaction on the rheological and thermal performance of silica nanoparticles reinforced epoxy nanocomposites. 期刊论文  OAI收割 COMPOSITES PART B-ENGINEERING, 2017 作者:  Guo, Qian;  Zhu, Pengli;  Li, Gang;  Wen, Junjie;  Wang, Tianyu   |  收藏  |  浏览/下载：25/0  |  提交时间：2018/02/02 Improvements in thermo-mechanical and rheological properties of SiO2/epoxy composites using different types of SiO2 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016 作者:  Gang Li;  Wenjie Zhang;  Pengli Zhu;  Daoqiang Lu;  Tao Zhao 收藏  |  浏览/下载：24/0  |  提交时间：2017/01/13 Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode 会议论文  OAI收割 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者:  Baotan Zhang;  Rong Sun;  Yankang Han;  Pengli Zhu;  Daoqiang(Daniel) Lu 收藏  |  浏览/下载：34/0  |  提交时间：2017/01/15 Low cost and highly conductive elastic composites for flexible and printable electronics 期刊论文  OAI收割 JOURNAL OF MATERIALS CHEMISTRY C, 2016 作者:  Hu, Yougen;  Zhao, Tao;  Zhu, Pengli;  Zhu, Yu;  Shuai, Xingtian 收藏  |  浏览/下载：35/0  |  提交时间：2017/01/13 Underfill Technology for Fine Pitch Flip Chip Application 会议论文  OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Pengli Zhu;  Gang Li;  Qian Guo;  Tao Zhao;  Daoqiang Lu 收藏  |  浏览/下载：46/0  |  提交时间：2017/01/15 Insights into the role of interface in the rheological property of underfill composites 会议论文  OAI收割 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者:  Qian Guo;  Pengli Zhu;  Junjie Wen 收藏  |  浏览/下载：20/0  |  提交时间：2017/01/15 Mesoporous Silica Nanoparticles: A Potential Inorganic Filler To Prepare Polymer Composites With Low CTE And Low Modulus For Electronic Packaging Applications 会议论文  OAI收割 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV 作者:  Li, Gang;  Zhu, Pengli;  Zhao, Tao;  Sun, Rong;  Lu, Daoqiang 收藏  |  浏览/下载：28/0  |  提交时间：2017/01/15 Highly stable and re-dispersible nano Cu hydrosols with sensitively size-dependent catalytic and antibacterial activities 期刊论文  OAI收割 Nanoscale, 2015, 卷号: 7, 期号: 32, 页码: 13775-13783 作者:  Zhang, Yu;  Zhu, Pengli;  Li, Gang;  Wang, Wenzhao;  Chen, Liang 收藏  |  浏览/下载：32/0  |  提交时间：2015/10/29 Spherical and flake-like BN filled epoxy composites: morphological effect on the thermal conductivity, thermo-mechanical and dielectric properties 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015 作者:  Liang Huang;  Pengli Zhu;  Gang Li;  Fengrui Zhou;  Daoqiang Lu 收藏  |  浏览/下载：34/0  |  提交时间：2016/01/27 One-pot synthesis of silica nanospheres with bimodal size distribution for application in underfill composite 会议论文  OAI收割 The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China 作者:  Qian Guo;  Gang Li;  Pengli Zhu;  Rong Sun;  Daoqiang (Daniel) Lu 收藏  |  浏览/下载：30/0  |  提交时间：2016/01/27