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	Guidelines for the use and interpretation of assays for monitoring autophagy (3rd edition) 期刊论文 OAI收割 AUTOPHAGY, 2016, 卷号: 12, 期号: 1, 页码: 1-222 作者: Arcaro, Alexandre; Arias, Esperanza; Arimoto, Hirokazu; Ariosa, Aileen R.; Armstrong, Jane L. \| 收藏 \| 浏览/下载：376/0 \| 提交时间：2018/12/29 autolysosome autophagosome chaperone-mediated autophagy flux LC3 lysosome macroautophagy phagophore stress vacuole
	Guidelines for the use and interpretation of assays for monitoring autophagy (3rd edition) 期刊论文 OAI收割 AUTOPHAGY, 2016, 卷号: 12, 页码: 1-222 作者: Klionsky, Daniel J.; Abdelmohsen, Kotb; Abe, Akihisa; Abedin, Md Joynal; Abeliovich, Hagai \| 收藏 \| 浏览/下载：620/0 \| 提交时间：2018/05/31 Autolysosome Autolysosome Autophagosome Autophagosome Chaperone-mediated Autophagy Chaperone-mediated Autophagy Flux Flux Lc3 Lc3 Lysosome Lysosome Macroautophagy Macroautophagy Phagophore Phagophore Stress Stress Vacuole Vacuole Autolysosome Autolysosome Autophagosome Autophagosome Chaperone-mediated Autophagy Chaperone-mediated Autophagy Flux Flux Lc3 Lc3 Lysosome Lysosome Macroautophagy Macroautophagy Phagophore Phagophore Stress Stress Vacuole Vacuole Autolysosome Autophagosome Chaperone-mediated Autophagy Flux Lc3 Lysosome Macroautophagy Phagophore Stress Vacuole Autolysosome Autophagosome Chaperone-mediated Autophagy Flux Lc3 Lysosome Macroautophagy Phagophore Stress Vacuole
	Method for fabricating semiconductor lighting chip 专利 OAI收割专利号: US8664026, 申请日期: 2014-03-04, 公开日期: 2014-03-04 作者: TU, PO-MIN; HUANG, SHIH-CHENG \| 收藏 \| 浏览/下载：19/0 \| 提交时间：2019/12/24
	Method for fabricating light emitting semiconductor device for reducing defects of dislocation in the device 专利 OAI收割专利号: US8202752, 申请日期: 2012-06-19, 公开日期: 2012-06-19 作者: HUANG, SHIH CHENG; TU, PO MIN; YEH, YING CHAO; LIN, WEN YU; WU, PENG YI \| 收藏 \| 浏览/下载：17/0 \| 提交时间：2019/12/24
	Method for blocking dislocation propagation of semiconductor 专利 OAI收割专利号: US7943494, 申请日期: 2011-05-17, 公开日期: 2011-05-17 作者: WU, PENG YI; HUANG, SHIH CHENG; TU, PO MIN; YEH, YING CHAO; LIN, WEN YU \| 收藏 \| 浏览/下载：16/0 \| 提交时间：2019/12/24